Micron technology, inc. (20240258243). STACKED DIE MODULES FOR SEMICONDUCTOR DEVICE ASSEMBLIES AND METHODS OF MANUFACTURING STACKED DIE MODULES simplified abstract
STACKED DIE MODULES FOR SEMICONDUCTOR DEVICE ASSEMBLIES AND METHODS OF MANUFACTURING STACKED DIE MODULES
Organization Name
Inventor(s)
Jong Sik Paek of Taichung (TW)
STACKED DIE MODULES FOR SEMICONDUCTOR DEVICE ASSEMBLIES AND METHODS OF MANUFACTURING STACKED DIE MODULES - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240258243 titled 'STACKED DIE MODULES FOR SEMICONDUCTOR DEVICE ASSEMBLIES AND METHODS OF MANUFACTURING STACKED DIE MODULES
Simplified Explanation: The patent application describes stacked die modules for semiconductor device assemblies, where each module includes a shingled stack of semiconductor dies partially encapsulated by a dielectric structure. Conductive structures connect to bond pads on the dies, allowing for integration into a semiconductor device assembly.
Key Features and Innovation:
- Stacked die modules with shingled stack of semiconductor dies
- Dielectric structure partially encapsulating the stack
- Conductive structures connecting to bond pads on the dies
- Integration into semiconductor device assemblies with controller die and package substrate
- Bonding wires connecting terminals of the modules to package bond pads
Potential Applications: The technology can be applied in various semiconductor devices, such as memory modules, processors, and integrated circuits.
Problems Solved: The technology addresses the need for compact and efficient semiconductor device assemblies with stacked die modules.
Benefits:
- Increased integration density
- Enhanced performance
- Improved thermal management
- Simplified manufacturing processes
Commercial Applications: The technology can be utilized in the production of advanced electronic devices, leading to improved performance and efficiency in various industries such as consumer electronics, telecommunications, and automotive.
Prior Art: Prior art related to stacked die modules and semiconductor device assemblies can be found in research papers, patents, and industry publications.
Frequently Updated Research: Researchers are continuously exploring new materials and manufacturing techniques to further enhance the performance and reliability of stacked die modules in semiconductor device assemblies.
Questions about Stacked Die Modules: 1. What are the key advantages of using stacked die modules in semiconductor device assemblies? 2. How does the integration of conductive structures improve the functionality of stacked die modules?
Original Abstract Submitted
stacked die modules for semiconductor device assemblies and methods of manufacturing the modules are disclosed. in some embodiments, the module includes a shingled stack of semiconductor dies, each die having an uncovered porch with bond pads. further, a dielectric structure partially encapsulates the shingled stack of semiconductor dies. the dielectric structure includes openings corresponding to the bond pads. the module also includes conductive structures disposed on the dielectric structure, where each of the conductive structures extends over at least one porch of the semiconductor dies to connect to at least one bond pad through a corresponding opening. the semiconductor device assembly may include a controller die attached to a package substrate, the controller die carrying one or more stacked die modules, and bonding wires connecting terminals of the modules to package bond pads.
