Micron technology, inc. (20240251554). Integrated Assemblies and Methods of Forming Integrated Assemblies simplified abstract
Contents
Integrated Assemblies and Methods of Forming Integrated Assemblies
Organization Name
Inventor(s)
Alyssa N. Scarbrough of Boise ID (US)
Jordan D. Greenlee of Boise ID (US)
John D. Hopkins of Meridian ID (US)
Integrated Assemblies and Methods of Forming Integrated Assemblies - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240251554 titled 'Integrated Assemblies and Methods of Forming Integrated Assemblies
The integrated assembly described in the patent application consists of a memory region and another region adjacent to it. Within the memory region, there are channel-material pillars, while conductive posts are arranged in the other region. A source structure is connected to the lower regions of the channel-material pillars, and a panel extends across both regions. Doped-semiconductor-material is directly adjacent to the panel in both regions, forming part of the source structure in the memory region. Liners surround the conductive posts and are positioned between the conductive posts and the doped-semiconductor-material.
- Channel-material pillars and conductive posts are key components of the integrated assembly.
- Doped-semiconductor-material is utilized as part of the source structure within the memory region.
- Liners play a crucial role in the assembly by surrounding the conductive posts and separating them from the doped-semiconductor-material.
Potential Applications: - This technology could be applied in the development of advanced memory storage devices. - It may find use in the creation of high-performance electronic components.
Problems Solved: - The integrated assembly addresses the need for efficient and reliable memory storage solutions. - It offers a way to enhance the performance of electronic devices through innovative design.
Benefits: - Improved memory storage capabilities. - Enhanced functionality of electronic components. - Potential for increased speed and efficiency in data processing.
Commercial Applications: Title: Advanced Memory Storage Technology for Electronic Devices This technology could revolutionize the memory storage industry by offering faster and more reliable solutions for electronic devices. It has the potential to be widely adopted in various sectors, including consumer electronics, data centers, and telecommunications.
Questions about the Technology: 1. How does the integrated assembly improve memory storage efficiency? 2. What sets this technology apart from existing memory storage solutions?
Original Abstract Submitted
some embodiments include an integrated assembly having a memory region and another region adjacent the memory region. channel-material-pillars are arranged within the memory region, and conductive posts are arranged within said other region. a source structure is coupled to lower regions of the channel-material-pillars. a panel extends across the memory region and the other region. doped-semiconductor-material is directly adjacent to the panel within the memory region and the other region. the doped-semiconductor-material is at least part of the source structure within the memory region. liners are directly adjacent to the conductive posts and laterally surround the conductive posts. the liners are between the conductive posts and the doped-semiconductor-material. some embodiments include methods of forming integrated assemblies.
