Micron technology, inc. (20240237363). TECHNIQUES FOR MODULAR DIE CONFIGURATIONS FOR MULTI-CHANNEL MEMORY simplified abstract
Contents
TECHNIQUES FOR MODULAR DIE CONFIGURATIONS FOR MULTI-CHANNEL MEMORY
Organization Name
Inventor(s)
James Brian Johnson of Boise ID (US)
Ameen D. Akel of Rancho Cordova CA (US)
Kunal R. Parekh of Boise ID (US)
Amy Rae Griffin of Boise ID (US)
Eiichi Nakano of Boise ID (US)
TECHNIQUES FOR MODULAR DIE CONFIGURATIONS FOR MULTI-CHANNEL MEMORY - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240237363 titled 'TECHNIQUES FOR MODULAR DIE CONFIGURATIONS FOR MULTI-CHANNEL MEMORY
The patent application describes methods, systems, and devices for modular die configurations for multi-channel memory.
- A semiconductor component, such as a wafer, can be configured with multiple rows and columns of memory arrays and associated channels.
- Each row of memory arrays may have a contact region along the row direction, while control regions extend along the column direction between some columns of memory arrays.
- Control regions contain circuitry to operate memory arrays on one or both sides of the region.
- The semiconductor wafer can be divided into independently-operable memory dies, each with a portion of a control region and a contact region for operating the memory arrays.
Potential Applications: - This technology can be applied in the manufacturing of high-performance memory modules for various electronic devices. - It can enhance the efficiency and speed of data processing in computers, servers, and other systems requiring fast memory access.
Problems Solved: - The technology addresses the need for improved memory configurations that can handle multiple data channels simultaneously. - It solves the challenge of optimizing memory array operations within a semiconductor component.
Benefits: - Increased data processing speed and efficiency. - Enhanced memory module performance for demanding applications. - Simplified design and manufacturing processes for memory components.
Commercial Applications: Title: "Innovative Modular Die Configurations for High-Performance Memory Modules" This technology can be commercially used in the production of advanced memory modules for servers, data centers, gaming systems, and other high-performance computing devices. The market implications include improved product competitiveness and enhanced user experience.
Questions about Modular Die Configurations for Multi-Channel Memory: 1. How does this technology improve memory access speed in electronic devices? This technology enhances memory access speed by optimizing memory array operations and enabling multiple data channels to operate simultaneously.
2. What are the potential cost savings associated with implementing modular die configurations for memory modules? Implementing modular die configurations can lead to cost savings in manufacturing processes, as it simplifies the design and production of memory components.
Original Abstract Submitted
methods, systems, and devices for modular die configurations for multi-channel memory are described. a semiconductor component (e.g., a semiconductor wafer) may be configured with multiple rows and multiple columns of memory arrays, and associated channels. a row of memory arrays may be associated with a contact region extending along the row direction. the semiconductor component may also include control regions extending along the column direction between at least some of the columns of memory arrays. each control region may include control circuitry for operating memory arrays on one or both sides of the control region. the channels and memory arrays of the semiconductor wafer may be grouped into one or more independently-operable memory dies, with each memory die having at least a portion of a control region and at least a portion of a contact region for operating the memory arrays of the memory die.
