Micron technology, inc. (20240234324). INDUCTORS WITH THROUGH-SUBSTRATE VIA CORES simplified abstract
Contents
INDUCTORS WITH THROUGH-SUBSTRATE VIA CORES
Organization Name
Inventor(s)
Kyle K. Kirby of Eagle ID (US)
INDUCTORS WITH THROUGH-SUBSTRATE VIA CORES - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240234324 titled 'INDUCTORS WITH THROUGH-SUBSTRATE VIA CORES
Simplified Explanation: This patent application describes a semiconductor device with a through-substrate via (TSV) and a helical conductor around the TSV to generate a magnetic field in response to current passing through it.
Key Features and Innovation:
- Semiconductor device with TSV and helical conductor
- Helical conductor generates magnetic field in TSV
- Multiple TSVs and helical conductors can be included
Potential Applications: This technology could be used in various semiconductor applications where magnetic fields are required for specific functions.
Problems Solved: This innovation addresses the need for generating magnetic fields within a semiconductor device efficiently and effectively.
Benefits:
- Enhanced functionality in semiconductor devices
- Improved performance due to magnetic field generation
- Potential for more compact and efficient designs
Commercial Applications: This technology could have commercial applications in the semiconductor industry for devices requiring magnetic field generation, such as sensors or memory devices.
Prior Art: Readers interested in prior art related to this technology could explore patents or research papers on semiconductor devices with magnetic field generation capabilities.
Frequently Updated Research: Stay updated on the latest research in semiconductor devices with magnetic field generation capabilities to understand advancements in the field.
Questions about Semiconductor Devices with Helical Conductors: 1. What are the potential limitations of using helical conductors in semiconductor devices? 2. How does the magnetic field generated by the helical conductor impact the overall performance of the semiconductor device?
Original Abstract Submitted
a semiconductor device comprising a substrate is provided. the device further comprises a through-substrate via (tsv) extending into the substrate, and a substantially helical conductor disposed around the tsv. the substantially helical conductor can be configured to generate a magnetic field in the tsv in response to a current passing through the helical conductor. more than one tsv can be included, and/or more than one substantially helical conductor can be provided.
