Micron technology, inc. (20240233791). FUSE DELAY OF A COMMAND IN A MEMORY PACKAGE simplified abstract
Contents
FUSE DELAY OF A COMMAND IN A MEMORY PACKAGE
Organization Name
Inventor(s)
Christopher G. Wieduwilt of Boise ID (US)
Lawrence D. Smith of Boise ID (US)
James S. Rehmeyer of Boise ID (US)
FUSE DELAY OF A COMMAND IN A MEMORY PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240233791 titled 'FUSE DELAY OF A COMMAND IN A MEMORY PACKAGE
The abstract of the patent application describes a technology where fuses can store different delay states to stagger the execution of a command for different memory dies within a memory package. Fuse arrays are included in the memory package and can be programmed to cause varying delays for different dies, providing flexibility in command execution timing.
- Fuse arrays can be fabricated and programmed to store different delay states for different memory dies.
- This technology allows for staggered execution of commands within a memory package.
- By programming the fuse arrays, different dies can be set to execute commands with varying delays.
- The flexibility in command execution timing can optimize performance and efficiency in memory operations.
- This innovation offers a customizable approach to managing command execution across multiple memory dies.
Potential Applications: - Memory packages in data centers - High-performance computing systems - Embedded systems requiring precise command execution timing
Problems Solved: - Efficiently managing command execution across multiple memory dies - Optimizing performance in memory operations - Providing flexibility in timing for different memory dies
Benefits: - Improved performance and efficiency in memory operations - Customizable command execution timing for different dies - Enhanced flexibility in memory package configurations
Commercial Applications: Title: Customizable Command Execution Timing Technology for Memory Packages This technology can be utilized in data centers, high-performance computing systems, and embedded systems to optimize memory operations and improve overall system performance. The ability to customize command execution timing for different memory dies can lead to more efficient data processing and enhanced system reliability.
Prior Art: Further research can be conducted in the field of memory package technologies, specifically focusing on command execution timing and the use of fuse arrays to control delays in memory dies.
Frequently Updated Research: Stay updated on advancements in memory package technologies, particularly in the area of command execution timing and the integration of customizable delay states for memory dies.
Questions about Customizable Command Execution Timing Technology for Memory Packages: 1. How does this technology improve performance in memory operations? This technology enhances performance by allowing for customized command execution timing for different memory dies, optimizing data processing efficiency.
2. What are the potential applications of this technology in different industries? This technology can be applied in data centers, high-performance computing systems, and embedded systems to improve memory operations and system performance.
Original Abstract Submitted
fuses can store different delay states to cause execution of a command to be staggered for different memory dies of a memory package. fuse arrays can be included in the memory package and programmed to cause execution of a command to be delayed by different amounts for different dies. the fuse arrays can be fabricated and then programmed to cause different delays for different dies.
