Micron technology, inc. (20240231459). POWER MANAGEMENT AND DELIVERY FOR HIGH BANDWIDTH MEMORY simplified abstract
Contents
- 1 POWER MANAGEMENT AND DELIVERY FOR HIGH BANDWIDTH MEMORY
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 POWER MANAGEMENT AND DELIVERY FOR HIGH BANDWIDTH MEMORY - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Commercial Applications
- 1.9 Questions about High Bandwidth Memory Power Management
- 1.10 Original Abstract Submitted
POWER MANAGEMENT AND DELIVERY FOR HIGH BANDWIDTH MEMORY
Organization Name
Inventor(s)
Rajesh H. Kariya of Boise ID (US)
POWER MANAGEMENT AND DELIVERY FOR HIGH BANDWIDTH MEMORY - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240231459 titled 'POWER MANAGEMENT AND DELIVERY FOR HIGH BANDWIDTH MEMORY
Simplified Explanation
The patent application describes methods, systems, and devices for power management and delivery for high bandwidth memory. It includes a power management integrated circuit (PMIC) and a voltage regulator integrated within the high bandwidth memory system.
- A high bandwidth memory (HBM) device may include a PMIC and a voltage regulator integrated within the interface die of the HBM system.
- The HBM system may be supplied a higher voltage and regulate it to a desired power level, increasing the total power available without increasing the quantity of microbumps.
- Ground voltage, positive voltage, or both, may be supplied to the HBM device via a back interface, reducing the quantity of microbumps at the front interface.
- A modified heatsink assembly may supply the ground voltage, positive voltage, or both, to the HBM system.
Potential Applications
The technology can be applied in high-performance computing systems, data centers, graphics cards, and other devices requiring high bandwidth memory with efficient power management.
Problems Solved
This technology addresses the challenges of power management and delivery in high bandwidth memory systems, optimizing power levels without increasing the complexity of the system.
Benefits
The benefits of this technology include improved power efficiency, increased total power availability, reduced microbumps, and enhanced performance of high bandwidth memory systems.
Commercial Applications
- High-performance computing systems
- Data centers
- Graphics cards
- Artificial intelligence applications
Questions about High Bandwidth Memory Power Management
How does the integration of a power management integrated circuit within the high bandwidth memory system improve power efficiency?
Integrating a PMIC within the HBM system allows for more efficient regulation of power levels, optimizing performance without increasing complexity.
What are the potential implications of reducing the quantity of microbumps in high bandwidth memory systems?
Reducing the quantity of microbumps can lead to a more streamlined and cost-effective design, improving overall system reliability and performance.
Original Abstract Submitted
methods, systems, and devices for power management and delivery for high bandwidth memory are described. a high bandwidth memory (hbm) device may include a power management integrated circuit (pmic) and a voltage regulator integrated within an interface die of the hbm system or included as a separate chip within the hbm system stack. accordingly, the hbm system may be supplied a higher voltage and may regulate the voltage to a desired power level, which may increase the total power available to the hbm system without increasing the quantity of microbumps. additionally, a ground voltage, a positive voltage, or both, may be supplied to the hbm device via a back interface of the hbm device, which may reduce the quantity of microbumps at a front interface. in some examples, a modified heatsink assembly may supply the ground voltage, the positive voltage, or both, to the hbm system.
