Micron technology, inc. (20240224461). APPARATUSES INCLUDING ONE OR MORE SEMICONDUCTOR DEVICES AND RELATED SYSTEMS simplified abstract
Contents
APPARATUSES INCLUDING ONE OR MORE SEMICONDUCTOR DEVICES AND RELATED SYSTEMS
Organization Name
Inventor(s)
Michael G. Placke of McKinney TX (US)
APPARATUSES INCLUDING ONE OR MORE SEMICONDUCTOR DEVICES AND RELATED SYSTEMS - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240224461 titled 'APPARATUSES INCLUDING ONE OR MORE SEMICONDUCTOR DEVICES AND RELATED SYSTEMS
The patent application describes memory devices with a substrate supporting semiconductor devices, featuring an interface for external electrical connection and hook-shaped engagement structures for securing the substrate to a carrier.
- The substrate includes an interface for external electrical connection to the semiconductor device.
- Hook-shaped engagement structures are located near the interface to secure the substrate to a carrier.
- The end of the substrate lacks screw keep-outs.
- A carrier includes posts positioned to secure the end of the substrate to the carrier.
- Sidewalls extend from a crossbar for placement along the lateral periphery of the substrate.
Potential Applications: - Memory devices in electronic devices - Semiconductor manufacturing industry
Problems Solved: - Secure attachment of substrates to carriers - Efficient external electrical connection for semiconductor devices
Benefits: - Enhanced stability of memory devices - Simplified assembly process - Improved reliability in electronic devices
Commercial Applications: Title: "Innovative Memory Device Substrate Attachment System" This technology can be applied in the semiconductor manufacturing industry to improve the assembly process of memory devices, leading to more reliable electronic products in the market.
Questions about the technology: 1. How does the hook-shaped engagement structure improve the attachment of the substrate to the carrier? - The hook-shaped engagement structures provide a secure connection between the substrate and the carrier, ensuring stability and reliability in memory devices. 2. What are the advantages of having sidewalls extending from a crossbar along the lateral periphery of the substrate? - The sidewalls enhance the structural integrity of the memory device, preventing potential damage during handling and operation.
Original Abstract Submitted
memory devices may include a substrate supporting at least one semiconductor device thereon. the substrate may include an interface located proximate to an end of the substrate and sized, shaped, and configured to provide external electrical connection to the at least one semiconductor device. hook-shaped engagement structures may be located proximate to, and laterally outward from, the interface, the engagement structures extending laterally beyond a longitudinal remainder of a lateral periphery of the substrate trailing the engagement structures. the end of the substrate may lack screw keep-outs. a carrier may include posts shaped, positioned, and configured to be positioned in throats of the hook-shaped engagement structures to secure the end of the substrate to the carrier. sidewalls may extend longitudinally from a crossbar for placement along the remainder of the lateral periphery of the substrate.
