Micron technology, inc. (20240222325). SEMICONDUCTOR ASSEMBLIES USING EDGE STACKING AND METHODS OF MANUFACTURING THE SAME simplified abstract
Contents
SEMICONDUCTOR ASSEMBLIES USING EDGE STACKING AND METHODS OF MANUFACTURING THE SAME
Organization Name
Inventor(s)
Thomas H. Kinsley of Boise ID (US)
SEMICONDUCTOR ASSEMBLIES USING EDGE STACKING AND METHODS OF MANUFACTURING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240222325 titled 'SEMICONDUCTOR ASSEMBLIES USING EDGE STACKING AND METHODS OF MANUFACTURING THE SAME
The abstract of this patent application describes semiconductor assemblies and packages utilizing edge stacking, along with associated systems and methods. A semiconductor package consists of a base substrate with one or more dies attached to it, encapsulated by a mold material. The package also includes connectors on a side surface, electrically coupled to the base substrate and/or the dies, which can further connect the package to neighboring semiconductor packages or electrical circuits.
- Semiconductor package with edge stacking
- Base substrate with attached dies
- Mold material encapsulation
- Connectors for electrical coupling
- Ability to connect to neighboring packages or circuits
Potential Applications: - Semiconductor industry - Electronics manufacturing - Integrated circuits
Problems Solved: - Enhanced electrical connectivity - Improved packaging efficiency - Neater and more compact semiconductor assemblies
Benefits: - Increased reliability - Better performance - Simplified manufacturing processes
Commercial Applications: Title: Advanced Semiconductor Packaging Technology for Enhanced Connectivity This technology can be applied in various industries such as consumer electronics, automotive, telecommunications, and medical devices. It offers improved performance and reliability in semiconductor packaging, making it a valuable innovation for companies looking to enhance their products.
Prior Art: Researchers and engineers in the semiconductor field have been exploring various methods to improve packaging efficiency and electrical connectivity. Previous patents and publications related to edge stacking and connector technologies can provide valuable insights into the development of this innovation.
Frequently Updated Research: Ongoing research in semiconductor packaging focuses on optimizing materials and processes to further enhance the performance and reliability of semiconductor assemblies. Stay updated on the latest advancements in edge stacking and connector technologies to ensure the competitiveness of your products in the market.
Questions about Semiconductor Assemblies and Packages using Edge Stacking: 1. How does edge stacking improve the efficiency of semiconductor packaging? Edge stacking allows for a more compact and organized arrangement of dies and connectors, reducing the overall footprint of the semiconductor package and enhancing electrical connectivity.
2. What are the key challenges in implementing edge stacking in semiconductor assemblies? One of the main challenges is ensuring precise alignment and connection of the dies and connectors during the stacking process to avoid any electrical or mechanical issues in the final package.
Original Abstract Submitted
semiconductor assemblies and packages using edge stacking and associated systems and methods are disclosed herein. a semiconductor package may include (1) a base substrate having a base surface, (2) one or more dies attached over the base surface, and (3) a mold material encapsulating the base substrate and the one or more dies. the package may further include connectors on a side surface thereof, wherein the connectors are electrically coupled to the base substrate and/or the one or more dies. the connectors may be further configured to electrically couple the package to one or more neighboring semiconductor packages and/or electrical circuits.
