Micron technology, inc. (20240222268). SEMICONDUCTOR DEVICE HAVING CONTACT PLUG simplified abstract
Contents
SEMICONDUCTOR DEVICE HAVING CONTACT PLUG
Organization Name
Inventor(s)
TAKAYOSHI Tashiro of Higashihiroshima (JP)
HIROKI Yamawaki of Higashihiroshima (JP)
AKIRA Kaneko of Higashihiroshima (JP)
SEMICONDUCTOR DEVICE HAVING CONTACT PLUG - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240222268 titled 'SEMICONDUCTOR DEVICE HAVING CONTACT PLUG
Simplified Explanation: The patent application describes an apparatus with a contact plug embedded in a contact hole, surrounded by a barrier metal part, and covered by interlayer insulating films with conductive patterns.
- The apparatus includes a contact plug embedded in a contact hole, surrounded by a barrier metal part.
- The interlayer insulating films cover the contact plug and include conductive patterns.
- A gap between the outer wall of the contact plug and the inner wall of the contact hole is filled with part of the interlayer insulating film.
Key Features and Innovation:
- Contact plug embedded in a contact hole with a barrier metal part for improved conductivity.
- Interlayer insulating films with conductive patterns for electrical connections.
- Gap filling between the contact plug and contact hole walls for enhanced insulation.
Potential Applications: This technology can be applied in semiconductor manufacturing, integrated circuits, and electronic devices requiring precise electrical connections.
Problems Solved:
- Improved electrical conductivity and insulation in semiconductor devices.
- Enhanced reliability and performance of electronic components.
Benefits:
- Increased efficiency and reliability of electrical connections.
- Enhanced performance and longevity of semiconductor devices.
- Improved manufacturing processes for integrated circuits.
Commercial Applications: Potential commercial applications include semiconductor manufacturing, electronics industry, and research and development in the field of integrated circuits.
Questions about the Technology: 1. How does the barrier metal part enhance the conductivity of the contact plug? 2. What are the specific advantages of filling the gap between the contact plug and contact hole walls with the interlayer insulating film?
Frequently Updated Research: Ongoing research in semiconductor manufacturing and integrated circuit design may provide further insights into the applications and benefits of this technology.
Original Abstract Submitted
an apparatus that includes a first interlayer insulating film having a contact hole; a contact plug embedded in the contact hole, the contact plug including a main part and a barrier metal part located between an outer wall of the main part and an inner wall of the contact hole; a second interlayer insulating film covering the first interlayer insulating film; and a first conductive pattern embedded in the second interlayer insulating film and connected to the contact plug. apart of the second interlayer insulating film is embedded in a gap between a top part of the outer wall of the main part of the contact plug and a top part of the inner wall of the contact hole.
