Micron technology, inc. (20240222184). SEMICONDUCTOR SUBSTRATE WITH A SACRIFICIAL ANNULUS simplified abstract
Contents
SEMICONDUCTOR SUBSTRATE WITH A SACRIFICIAL ANNULUS
Organization Name
Inventor(s)
Jeremy E. Minnich of Boise ID (US)
Andrew M. Bayless of Boise ID (US)
SEMICONDUCTOR SUBSTRATE WITH A SACRIFICIAL ANNULUS - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240222184 titled 'SEMICONDUCTOR SUBSTRATE WITH A SACRIFICIAL ANNULUS
Simplified Explanation:
This patent application describes a semiconductor substrate with a sacrificial annulus that separates the center portion from the peripheral portion. By thinning the substrate, the sacrificial annulus can be exposed, disconnecting the two portions and creating a mechanically robust edge.
- The semiconductor substrate has a sacrificial annulus separating the center and peripheral portions.
- Thinning the substrate exposes the sacrificial annulus, disconnecting the two portions.
- The resulting substrate edge is planar and free of sharp edges, increasing mechanical robustness.
Key Features and Innovation:
- Semiconductor substrate with sacrificial annulus for improved mechanical robustness.
- Thinning process to expose sacrificial annulus and disconnect substrate portions.
- Creation of planar substrate edge without sharp edges for increased durability.
Potential Applications:
This technology could be applied in semiconductor manufacturing processes where mechanical robustness is crucial, such as in the production of electronic devices and sensors.
Problems Solved:
This technology addresses the issue of substrate fragility by creating a more durable edge through the sacrificial annulus separation process.
Benefits:
- Enhanced mechanical robustness of semiconductor substrates.
- Improved durability and longevity of electronic devices and sensors.
Commercial Applications:
Potential commercial applications include the production of smartphones, tablets, and other electronic devices that require durable semiconductor substrates.
Prior Art:
Researchers interested in this technology may want to explore prior art related to sacrificial materials in semiconductor manufacturing processes.
Frequently Updated Research:
Researchers in the field of semiconductor manufacturing may be conducting ongoing studies on the use of sacrificial materials to enhance substrate durability.
Questions about Semiconductor Substrates:
1. How does the sacrificial annulus in the semiconductor substrate improve mechanical robustness? 2. What are the potential long-term implications of using sacrificial materials in semiconductor manufacturing processes?
Original Abstract Submitted
a semiconductor substrate is provided. the semiconductor substrate includes a center portion and a peripheral portion. the semiconductor substrate further includes an annulus of sacrificial material disposed at a front side of the semiconductor substrate and extending at least partially through the semiconductor substrate. the annulus of sacrificial material separates the center portion of the substrate from the peripheral portion of the substrate at the front side. the semiconductor substrate can be thinned to expose the annulus of sacrificial material and disconnect the peripheral portion from the center portion. in doing so, the thinned substrate may have a planar substrate edge void of sharp edges, thereby increasing its mechanical robustness.
