Micron technology, inc. (20240222183). CROSSLINKING A BACK GRINDING TAPE FOR A SEMICONDUCTOR WAFER simplified abstract
Contents
CROSSLINKING A BACK GRINDING TAPE FOR A SEMICONDUCTOR WAFER
Organization Name
Inventor(s)
Ankur Harish Shah of Singapore (SG)
Venkateswarlu Bhavanasi of Singapore (SG)
Harjashan Veer Singh of South Richmond Hill NY (US)
CROSSLINKING A BACK GRINDING TAPE FOR A SEMICONDUCTOR WAFER - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240222183 titled 'CROSSLINKING A BACK GRINDING TAPE FOR A SEMICONDUCTOR WAFER
The abstract of this patent application describes a semiconductor device assembly involving a semiconductor wafer with circuit elements and a back grinding tape adhered to the wafer. The back grinding tape has a polymer base layer and an adhesive layer, with a damping ratio of less than 0.8. The tape can have crosslinking groups that vary in degree of crosslinking based on heat or infrared radiation applied.
- Semiconductor assembly with back grinding tape
- Tape has polymer base and adhesive layer
- Damping ratio of less than 0.8
- Crosslinking groups for variable crosslinking
- Degree of crosslinking changes with heat or infrared radiation
Potential Applications: - Semiconductor manufacturing - Electronics industry - Integrated circuit production
Problems Solved: - Improved stability during back grinding process - Enhanced protection for semiconductor wafer - Better control over crosslinking for tape adhesion
Benefits: - Higher quality semiconductor assemblies - Increased efficiency in manufacturing process - Reduced risk of damage to circuit elements
Commercial Applications: Title: Advanced Semiconductor Device Assembly for Enhanced Manufacturing This technology can be used in the semiconductor industry for producing high-quality integrated circuits with improved stability and protection during manufacturing processes. It can have significant implications for the electronics industry by enhancing the efficiency and reliability of semiconductor device assemblies.
Questions about Semiconductor Device Assembly: 1. How does the back grinding tape contribute to the overall stability of the semiconductor assembly? 2. What are the key advantages of using crosslinking groups in the back grinding tape for semiconductor wafer adhesion?
Frequently Updated Research: Researchers are continually exploring new materials and methods to enhance semiconductor device assembly processes. Stay updated on the latest advancements in semiconductor manufacturing to optimize production efficiency and product quality.
Original Abstract Submitted
implementations described herein relate to various semiconductor device assemblies and methods of forming the same. in some implementations, a semiconductor assembly may include a semiconductor wafer including a face including one or more circuit elements and a back grinding tape adhered to the face. the back grinding tape may include a polymer base layer and an adhesive layer adhering the back grinding tape to the face of the semiconductor wafer, and the back grinding tape may exhibit a damping ratio of less than approximately 0.8. the back grinding tape may include at least one of infrared-activated crosslinking groups or thermally activated crosslinking groups such that a degree of crosslinking associated with the back grinding tape may vary according to at least one of an amount of heat applied to the back grinding tape or an amount of infrared radiation applied to the back grinding tape.
