Micron technology, inc. (20240222145). SEMICONDUCTOR DEVICE WITH A MULTI-LAYERED ENCAPSULANT AND ASSOCIATED SYSTEMS, DEVICES, AND METHODS simplified abstract
Contents
SEMICONDUCTOR DEVICE WITH A MULTI-LAYERED ENCAPSULANT AND ASSOCIATED SYSTEMS, DEVICES, AND METHODS
Organization Name
Inventor(s)
Jonathan S. Hacker of Meridian ID (US)
SEMICONDUCTOR DEVICE WITH A MULTI-LAYERED ENCAPSULANT AND ASSOCIATED SYSTEMS, DEVICES, AND METHODS - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240222145 titled 'SEMICONDUCTOR DEVICE WITH A MULTI-LAYERED ENCAPSULANT AND ASSOCIATED SYSTEMS, DEVICES, AND METHODS
The semiconductor device described in the patent application includes a substrate with traces protruding above its surface, a prefill material between the traces, a die attached to the substrate, and a wafer-level underfill between the prefill material and the die.
- Traces on the substrate protrude above the surface.
- Prefill material is present between the traces.
- Die is attached to the substrate.
- Wafer-level underfill is located between the prefill material and the die.
Potential Applications: - Semiconductor manufacturing - Electronics industry - Integrated circuits
Problems Solved: - Improved reliability of semiconductor devices - Enhanced performance of electronic components
Benefits: - Better connectivity between components - Increased durability of devices - Enhanced overall functionality
Commercial Applications: Title: Advanced Semiconductor Devices for Enhanced Performance This technology can be used in various electronic devices, such as smartphones, computers, and automotive systems, to improve their performance and reliability.
Questions about Semiconductor Devices: 1. How does the prefill material contribute to the overall performance of the semiconductor device?
The prefill material helps to provide better connectivity between the traces on the substrate, improving the overall functionality of the device.
2. What are the key differences between wafer-level underfill and traditional underfill materials in semiconductor manufacturing?
Wafer-level underfill is applied at the wafer level before the die is attached, providing better protection and reliability compared to traditional underfill materials.
Original Abstract Submitted
a semiconductor device includes a substrate including traces, wherein the traces protrude above a top surface of the substrate; a prefill material over the substrate and between the traces; a die attached over the substrate; and a wafer-level underfill between the prefill material and the die.
