Micron technology, inc. (20240206069). PRINTED CIRCUIT BOARD OVER PRINTED CIRCUIT BOARD ASSEMBLY simplified abstract
Contents
PRINTED CIRCUIT BOARD OVER PRINTED CIRCUIT BOARD ASSEMBLY
Organization Name
Inventor(s)
Bradley Russell Bitz of Meridian ID (US)
David R. Christianson of Meridian ID (US)
Travis Michael Jensen of Boise ID (US)
Kimball Davis Lowry of Boise ID (US)
Joao Elmiro Chaves of Middleton ID (US)
PRINTED CIRCUIT BOARD OVER PRINTED CIRCUIT BOARD ASSEMBLY - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240206069 titled 'PRINTED CIRCUIT BOARD OVER PRINTED CIRCUIT BOARD ASSEMBLY
The abstract of this patent application describes an electronic system assembly that includes a first circuit substrate with a two-dimensional surface, multiple first semiconductor chip packages mounted on the surface, multiple second circuit substrates positioned over the surface, conductive interconnect structures extending in a third dimension, and second semiconductor chip packages mounted on and electrically coupled to the second circuit substrates.
- The electronic system assembly features a complex arrangement of semiconductor chip packages and circuit substrates in multiple dimensions.
- Conductive interconnect structures connect different circuit substrates to the first circuit substrate, enabling communication and data transfer between components.
- The design allows for efficient use of space and optimized connectivity between the various semiconductor chip packages and circuit substrates.
- This innovation enhances the overall performance and functionality of the electronic system assembly by facilitating seamless integration and communication between components.
- The assembly's unique layout and interconnect structure contribute to improved reliability and performance in electronic systems.
Potential Applications: - This technology can be applied in various electronic devices and systems that require multiple semiconductor chip packages and circuit substrates. - It can be used in telecommunications equipment, computer systems, consumer electronics, and other devices that rely on complex electronic assemblies.
Problems Solved: - Addresses the challenge of efficiently connecting multiple semiconductor chip packages and circuit substrates in a compact space. - Solves the problem of optimizing communication and data transfer between different components in an electronic system assembly.
Benefits: - Improved connectivity and communication between semiconductor chip packages and circuit substrates. - Enhanced reliability and performance of electronic systems. - Efficient use of space and resources in electronic device design.
Commercial Applications: - This technology has commercial applications in the electronics industry, particularly in the development of advanced electronic devices and systems. - It can be utilized by manufacturers of telecommunications equipment, computers, and consumer electronics to enhance the performance and functionality of their products.
Questions about the Technology: 1. How does the arrangement of semiconductor chip packages and circuit substrates in multiple dimensions improve the performance of electronic systems? 2. What specific challenges does this technology address in the design and assembly of electronic devices?
Original Abstract Submitted
an electronic system assembly includes a first circuit substrate having a surface, wherein the surface has a two-dimensional area defined in a first dimension and a second dimension; a plurality of first semiconductor chip packages mounted on and electrically coupled to the surface; a plurality of second circuit substrates positioned over the surface, wherein each first semiconductor chip package is arranged between the surface and a respective second circuit substrate in a third dimension; a plurality of conductive interconnect structures that extend in the third dimension, wherein the plurality of conductive interconnect structures are provided in a plurality of interconnect groups, and wherein each interconnect group connects a different second circuit substrate to the first circuit substrate; and a plurality of second semiconductor chip packages, wherein each second semiconductor chip package is mounted and electrically coupled to a respective second circuit substrate.
