Micron technology, inc. (20240203963). SYSTEMS AND METHODS FOR REDUCING THE SIZE OF A SEMICONDUCTOR ASSEMBLY simplified abstract
Contents
SYSTEMS AND METHODS FOR REDUCING THE SIZE OF A SEMICONDUCTOR ASSEMBLY
Organization Name
Inventor(s)
Kelvin Tan Aik Boo of Singapore (SG)
Chin Hui Chong of Singapore (SG)
Hem P. Takiar of Fremont CA (US)
SYSTEMS AND METHODS FOR REDUCING THE SIZE OF A SEMICONDUCTOR ASSEMBLY - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240203963 titled 'SYSTEMS AND METHODS FOR REDUCING THE SIZE OF A SEMICONDUCTOR ASSEMBLY
Simplified Explanation: This patent application discloses semiconductor devices and systems where a package substrate holds a controller die, a passive electrical component, and a stack of semiconductor dies. The controller die and passive electrical component support the stack of semiconductor dies.
- The semiconductor device includes a package substrate, a controller die, a passive electrical component, and a stack of semiconductor dies.
- The controller die and passive electrical component are attached to the front side of the package substrate.
- The stack of semiconductor dies is attached to the controller die and passive electrical component.
- The controller die and passive electrical component support the stack of semiconductor dies.
- The stack of semiconductor dies has a larger footprint than the controller die in at least one dimension.
Potential Applications: 1. Consumer electronics 2. Automotive industry 3. Telecommunications 4. Industrial automation 5. Internet of Things (IoT) devices
Problems Solved: 1. Efficient stacking of semiconductor dies 2. Improved thermal management 3. Enhanced performance in compact devices
Benefits: 1. Higher integration density 2. Improved reliability 3. Enhanced functionality 4. Better heat dissipation 5. Cost-effective manufacturing
Commercial Applications: The technology can be used in various industries such as consumer electronics, automotive, telecommunications, and IoT devices. It offers improved performance, reliability, and cost-effectiveness in compact electronic devices.
Prior Art: Readers interested in prior art related to this technology can explore patents in the field of semiconductor packaging, integrated circuits, and electronic component assembly.
Frequently Updated Research: Researchers in the field of semiconductor packaging and device integration are continuously working on improving the efficiency and performance of stacked semiconductor devices.
Questions about Semiconductor Device Stacking: 1. How does the size of the controller die compare to the stack of semiconductor dies in this technology? 2. What are the potential challenges in thermal management when stacking semiconductor dies in a compact device?
Original Abstract Submitted
semiconductor devices and associated systems and methods are disclosed herein. in some embodiments, the semiconductor device is an assembly that includes a package substrate having a front side and a backside opposite the front side. a controller die with a first longitudinal footprint can be attached to the front side of the package substrate. a passive electrical component is also attached to the front side of the package substrate. a stack of semiconductor dies can be attached to the controller die and the passive electrical component. the stack of semiconductor dies has a second longitudinal footprint greater than the first longitudinal footprint in at least one dimension. the controller die and the passive electrical component are positioned at least partially within the second longitudinal footprint, thereby at least partially supporting the stack of semiconductor dies.
