Micron technology, inc. (20240203842). SEMICONDUCTOR DEVICE ASSEMBLY WITH A CIRCULAR SEGMENTED PACKAGE EDGE simplified abstract
Contents
SEMICONDUCTOR DEVICE ASSEMBLY WITH A CIRCULAR SEGMENTED PACKAGE EDGE
Organization Name
Inventor(s)
Kelvin Aik Boo Tan of Singapore (SG)
Chin Hui Chong of Singapore (SG)
See Hiong Leow of Singapore (SG)
SEMICONDUCTOR DEVICE ASSEMBLY WITH A CIRCULAR SEGMENTED PACKAGE EDGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240203842 titled 'SEMICONDUCTOR DEVICE ASSEMBLY WITH A CIRCULAR SEGMENTED PACKAGE EDGE
The semiconductor device assembly described in the abstract includes a circuit substrate with holes along the substrate edge, at least one die on the substrate surface, and a package casing encapsulating the die and substrate surface.
- Circuit substrate with holes along the edge
- Die arranged on the substrate surface
- Package casing encapsulating the die and substrate surface
Potential Applications: - Semiconductor manufacturing - Electronics industry - Integrated circuit production
Problems Solved: - Enhanced protection for semiconductor devices - Improved assembly process efficiency
Benefits: - Increased durability of semiconductor devices - Secure encapsulation of dies - Streamlined manufacturing process
Commercial Applications: Title: Advanced Semiconductor Device Assembly for Enhanced Durability This technology can be used in the production of various electronic devices, such as smartphones, computers, and automotive electronics, to improve their performance and longevity.
Frequently Updated Research: Researchers are continuously exploring new materials and techniques to further enhance the durability and efficiency of semiconductor device assemblies.
Questions about Semiconductor Device Assembly: 1. How does the package casing protect the die and substrate surface? The package casing acts as a protective barrier, shielding the components from external elements and physical damage.
2. What are the potential implications of using this technology in the automotive industry? Implementing this technology in automotive electronics can lead to more reliable and long-lasting vehicle components, improving overall performance and safety.
Original Abstract Submitted
implementations described herein relate to various semiconductor device assemblies. in some implementations, a semiconductor device assembly includes a circuit substrate comprising a first substrate surface, a second substrate surface arranged opposite to the first substrate surface, and a substrate edge that extends from the first substrate surface to the second substrate surface; a series of holes arranged along the substrate edge of the circuit substrate, wherein each hole of the series of holes extends at least partially from the first substrate surface toward the second substrate surface; at least one die arranged on the first substrate surface; and a package casing disposed over the first substrate surface, wherein the package casing encapsulates the at least one die and the first substrate surface, and wherein the package casing fills each hole of the series of holes.
