Micron technology, inc. (20240203827). THERMAL MANAGEMENT OF GPU-HBM PACKAGE BY MICROCHANNEL INTEGRATED SUBSTRATE simplified abstract
Contents
- 1 THERMAL MANAGEMENT OF GPU-HBM PACKAGE BY MICROCHANNEL INTEGRATED SUBSTRATE
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 THERMAL MANAGEMENT OF GPU-HBM PACKAGE BY MICROCHANNEL INTEGRATED SUBSTRATE - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Key Features and Innovation
- 1.6 Potential Applications
- 1.7 Problems Solved
- 1.8 Benefits
- 1.9 Commercial Applications
- 1.10 Prior Art
- 1.11 Frequently Updated Research
- 1.12 Questions about Semiconductor Packages with Microchannels
- 1.13 Original Abstract Submitted
THERMAL MANAGEMENT OF GPU-HBM PACKAGE BY MICROCHANNEL INTEGRATED SUBSTRATE
Organization Name
Inventor(s)
Eiichi Nakano of Boise ID (US)
THERMAL MANAGEMENT OF GPU-HBM PACKAGE BY MICROCHANNEL INTEGRATED SUBSTRATE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240203827 titled 'THERMAL MANAGEMENT OF GPU-HBM PACKAGE BY MICROCHANNEL INTEGRATED SUBSTRATE
Simplified Explanation
This patent application discusses semiconductor packages and assemblies with microchannels for thermal management, including a microchannel module and microfluidic network. The technology involves dissipating heat from memory and logic devices using a coolant within the microchannel.
- The semiconductor package or assembly integrates a substrate with a microchannel for cooling.
- A coolant is used within the microchannel to dissipate heat from memory and logic devices.
- The microchannel is positioned beneath the memory and/or logic devices for efficient heat dissipation.
Key Features and Innovation
- Integration of microchannels in semiconductor packages for improved thermal management.
- Use of coolants within microchannels to dissipate heat from memory and logic devices.
- Efficient positioning of microchannels beneath memory and logic devices for optimal heat dissipation.
Potential Applications
This technology can be applied in various semiconductor devices requiring effective thermal management, such as CPUs, GPUs, and other high-performance electronic components.
Problems Solved
- Overheating issues in semiconductor devices.
- Inefficient heat dissipation from memory and logic devices.
- Lack of effective thermal management solutions in semiconductor packages.
Benefits
- Improved cooling efficiency in semiconductor packages.
- Enhanced performance and longevity of memory and logic devices.
- Reduction of overheating-related failures in electronic components.
Commercial Applications
- Semiconductor Thermal Management Solutions: Enhancing the performance and reliability of high-performance electronic devices.
- Electronics Manufacturing Industry: Improving thermal management in semiconductor packages for better product quality and longevity.
Prior Art
Research on microchannel cooling systems in semiconductor devices and related thermal management technologies can provide insights into prior art relevant to this innovation.
Frequently Updated Research
Stay updated on advancements in microchannel cooling systems, semiconductor thermal management, and related technologies for the latest developments in the field.
Questions about Semiconductor Packages with Microchannels
What are the key benefits of integrating microchannels in semiconductor packages for thermal management?
Integrating microchannels in semiconductor packages allows for efficient heat dissipation, improving the performance and longevity of memory and logic devices.
How does the use of coolants within microchannels contribute to better thermal management in semiconductor devices?
Coolants within microchannels help dissipate heat effectively, preventing overheating and enhancing the overall performance of semiconductor devices.
Original Abstract Submitted
semiconductor packages and/or assemblies having microchannels, a microchannel module, and/or a microfluidic network for thermal management, and associated systems and methods, are disclosed herein. the semiconductor package and/or assembly can include a substrate integrated with a microchannel and a coolant disposed within the microchannel to dissipate heat from a memory device and/or a logic device of the semiconductor package and/or assembly. the microchannel can be configured beneath the memory device and/or the logic device.
