Micron technology, inc. (20240203804). ENGINEERED SEMICONDUCTOR SUBSTRATE simplified abstract

From WikiPatents
Jump to navigation Jump to search

ENGINEERED SEMICONDUCTOR SUBSTRATE

Organization Name

micron technology, inc.

Inventor(s)

Darwin A. Clampitt of Wilder ID (US)

Roger W. Lindsay of Boise ID (US)

Lisa M. Clampitt of Boise ID (US)

ENGINEERED SEMICONDUCTOR SUBSTRATE - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240203804 titled 'ENGINEERED SEMICONDUCTOR SUBSTRATE

Simplified Explanation: The semiconductor device assembly described in the patent application involves a semiconductor die with an engineered portion and a semiconductive portion, where the engineered portion includes various materials compressed or arranged in specific ways. The semiconductive portion is directly adhered to the engineered portion, with a layer of dielectric material and circuitry added on top to create a cost-efficient and mechanically robust semiconductor device.

  • The semiconductor device assembly includes a semiconductor die with an engineered portion and a semiconductive portion.
  • The engineered portion consists of materials like sintered material, corrugated material, compressed strands, layers, or planar trusses.
  • The semiconductive portion is directly attached to the engineered portion.
  • A layer of dielectric material is placed on the semiconductive portion, followed by the addition of circuitry.
  • The assembly results in a cost-effective and mechanically strong semiconductor device.

Potential Applications: 1. Electronics manufacturing 2. Semiconductor industry 3. Integrated circuit production

Problems Solved: 1. Cost-effectiveness in semiconductor device assembly 2. Mechanical robustness in semiconductor devices

Benefits: 1. Enhanced durability 2. Lower production costs 3. Improved performance

Commercial Applications: The technology can be utilized in the production of various electronic devices, such as smartphones, computers, and automotive systems, to enhance their performance and durability.

Prior Art: Readers interested in exploring prior art related to this technology can start by researching semiconductor device assembly methods and materials used in the semiconductor industry.

Frequently Updated Research: Any advancements or updates in semiconductor device assembly techniques or materials could impact the implementation of this technology.

Questions about Semiconductor Device Assembly: 1. How does the engineered portion of the semiconductor device assembly contribute to its mechanical robustness? 2. What are the potential cost savings associated with using this semiconductor device assembly method?


Original Abstract Submitted

a semiconductor device assembly is provided. the semiconductive device assembly includes a semiconductor die with a substrate having an engineered portion and a semiconductive portion. the engineered portion includes one or more of: a sintered material, a corrugated material, oriented strands of material compressed to form a solid structure, layers of material compressed to form a solid structure, or a material arranged to form one or more planar trusses. the semiconductive portion is adhered directly to the engineered portion. a layer of dielectric material is disposed at the semiconductive portion, and circuitry is disposed at the layer of dielectric material. in doing so, a cost-efficient and mechanically robust semiconductor device may be assembled.

Retrieved from "http://wikipatents.org/index.php?title=Micron_technology,_inc._(20240203804)._ENGINEERED_SEMICONDUCTOR_SUBSTRATE_simplified_abstract&oldid=76549"