Micron technology, inc. (20240202145). Memory Die Interconnections to Physical Layer Interfaces simplified abstract
Contents
Memory Die Interconnections to Physical Layer Interfaces
Organization Name
Inventor(s)
Kang-Yong Kim of Boise ID (US)
Memory Die Interconnections to Physical Layer Interfaces - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240202145 titled 'Memory Die Interconnections to Physical Layer Interfaces
- Simplified Explanation:**
This patent application discusses how memory die interconnections to physical layer interfaces (PHYs) can enhance channel bus width and signal integrity. By connecting memory dies to PHYs, improved signal integrity and expanded channel bus width can be achieved.
- Key Features and Innovation:**
- Memory die connected to PHYs via command-and-address (CA) bus and data input/output (DQ) bus for improved signal integrity. - Memory die interconnected to different PHYs to expand channel bus width. - Training procedures performed by PHYs via CA signaling or DQ signaling to enhance signal integrity between memory die and PHYs.
- Potential Applications:**
- Data centers - High-performance computing - Networking equipment - Telecommunications systems
- Problems Solved:**
- Limited channel bus width - Signal integrity issues in memory die interconnections - Need for improved data transfer speeds
- Benefits:**
- Enhanced signal integrity - Expanded channel bus width - Improved data transfer speeds - Better performance in high-speed applications
- Commercial Applications:**
Commercial Applications: Enhanced signal integrity and expanded channel bus width can benefit industries such as data centers, high-performance computing, networking equipment, and telecommunications systems by improving data transfer speeds and overall system performance.
- Questions about Memory Die Interconnections to Physical Layer Interfaces:**
1. How do memory die interconnections to physical layer interfaces impact signal integrity? 2. What are the potential applications of expanded channel bus width in memory die interconnections?
- Frequently Updated Research:**
Stay updated on the latest advancements in memory die interconnections to physical layer interfaces to ensure optimal signal integrity and channel bus width for high-performance applications.
Original Abstract Submitted
this disclosure describes aspects of memory die interconnections to physical layer interfaces (phys) that may enable expanded channel bus width and improved signal integrity (si). in aspects, a memory die is operably coupled to a first phy via a command-and-address (ca) bus and data input/output (dq) bus of the first phy and to a second phy via a chip select (cs) bus of the second phy. the second phy may provide a cs signal to the memory die, and the first phy can perform a training procedure via ca signaling or dq signaling. the training procedure may improve si between the memory die and the phys. additionally, a memory die may be interconnected to different phys to expand a channel bus width. thus, by interconnecting memory dies to one or more phys as described herein, improved si and expanded channel bus width can be achieved.
