Micron technology, inc. (20240201252). EOP PROBING ON MULTI-DIE STACKS simplified abstract
Contents
EOP PROBING ON MULTI-DIE STACKS
Organization Name
Inventor(s)
John M. Gonzales of Boise ID (US)
Seth A. Eichmeyer of Boise ID (US)
Atsuko Otsuka of Hiroshima (JP)
Takeshi Kaku of Hiroshima (JP)
Soeparto Tandjoeng of Boise ID (US)
EOP PROBING ON MULTI-DIE STACKS - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240201252 titled 'EOP PROBING ON MULTI-DIE STACKS
Simplified Explanation: The patent application describes a method involving focusing light onto a memory die circuit to determine if a particular signal is being transferred.
Key Features and Innovation:
- Focusing a light source onto a circuit of a memory die
- Reflecting the light back toward a sensor
- Receiving the reflection of light from the circuit at the sensor
- Determining if a particular signal is being transferred based on the reflected light
Potential Applications: This technology could be used in the semiconductor industry for quality control and testing of memory dies.
Problems Solved: The technology helps in identifying if a specific signal is being transmitted within a memory die circuit accurately.
Benefits:
- Improved accuracy in signal detection
- Enhanced quality control in memory die manufacturing
Commercial Applications: Potential commercial applications include semiconductor manufacturing companies looking to improve their quality control processes.
Prior Art: Readers can start searching for prior art related to this technology in the field of semiconductor testing and quality control.
Frequently Updated Research: Stay updated on the latest advancements in semiconductor testing and quality control to enhance the application of this technology.
Questions about Memory Die Circuit Testing: 1. What are the potential implications of using this technology in the semiconductor industry? 2. How does this method compare to traditional testing methods for memory die circuits?
Original Abstract Submitted
an example method can include focusing a light source onto a circuit of a first memory die of a plurality of memory dies. a light of the light source can reach the circuit of the memory die and can be reflected back toward a sensor. the method can further include receiving the reflection of light from the circuit at the sensor. the method can further include determining whether the circuit is transferring a particular signal based on the reflected light.
