Micron technology, inc. (20240196569). THERMAL ISOLATION FOR MEMORY SYSTEMS simplified abstract
Contents
- 1 THERMAL ISOLATION FOR MEMORY SYSTEMS
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 THERMAL ISOLATION FOR MEMORY SYSTEMS - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Key Features and Innovation
- 1.6 Potential Applications
- 1.7 Problems Solved
- 1.8 Benefits
- 1.9 Commercial Applications
- 1.10 Prior Art
- 1.11 Frequently Updated Research
- 1.12 Questions about Thermal Isolation for Memory Systems
- 1.13 Original Abstract Submitted
THERMAL ISOLATION FOR MEMORY SYSTEMS
Organization Name
Inventor(s)
Suresh Reddy Yarragunta of Bangalore (IN)
Deepu Narasimiah Subhash of Bangalore (IN)
THERMAL ISOLATION FOR MEMORY SYSTEMS - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240196569 titled 'THERMAL ISOLATION FOR MEMORY SYSTEMS
Simplified Explanation
Methods, systems, and devices for thermal isolation for memory systems are described in the patent application. The enclosed heatsink architectures aim to impede heat transfer between different components, improving efficiency and performance.
- The patent describes using a partition, such as an air gap or thermally insulating material, between multiple heatsinks to enhance thermal isolation.
- Various structures of heat transfer elements are utilized in the heatsinks to optimize heat exchange.
- Overlapping heatsink architecture is employed to increase the size of the heatsink corresponding to specific components, improving heat dissipation.
- The inclusion of upper and lower heatsinks in the architecture helps reduce device overheating and thermal throttling, enhancing device durability and performance.
- The innovative heatsink designs not only improve cooling efficiency but also potentially save energy costs.
Key Features and Innovation
- Use of partitions between heatsinks for thermal isolation.
- Various structures of heat transfer elements in the heatsinks.
- Overlapping heatsink architecture for increased heat dissipation.
- Upper and lower heatsinks to reduce device overheating and thermal throttling.
- Improved cooling efficiency leading to potential energy cost savings.
Potential Applications
The technology can be applied in various memory systems, electronic devices, and computer hardware where thermal management is crucial.
Problems Solved
The technology addresses issues related to device overheating, thermal throttling, and inefficient heat dissipation in memory systems.
Benefits
- Enhanced device durability and performance.
- Improved cooling efficiency.
- Potential energy cost savings.
Commercial Applications
- The technology can be utilized in consumer electronics, data centers, and high-performance computing systems to improve thermal management and overall device performance.
Prior Art
Prior research on heatsink architectures and thermal management systems in memory devices can provide valuable insights into the development of this technology.
Frequently Updated Research
Stay updated on the latest advancements in heatsink designs, thermal management systems, and memory device technologies to enhance the effectiveness of the described innovation.
Questions about Thermal Isolation for Memory Systems
How does the overlapping heatsink architecture improve heat dissipation in memory systems?
The overlapping heatsink architecture increases the size of the heatsink corresponding to specific components, allowing for more efficient heat exchange and dissipation.
What are the potential energy cost savings associated with the enclosed heatsink architectures?
The enclosed heatsink architectures improve cooling efficiency, potentially reducing the energy required for cooling systems and leading to cost savings.
Original Abstract Submitted
methods, systems, and devices for thermal isolation for memory systems are described. the enclosed heatsink architectures may impede heat transfer from a first group of components to a second group components. some examples include a partition (an air gap or other thermally insulating material) between multiple heatsinks. the heatsinks may each have heat transfer elements with various structures. in some examples, a first heatsink may overlap a second heatsink. the overlapping architecture may increase the size of the heatsink corresponding to the first set of components and increase their rate of heat exchange. in some examples, the heatsink architecture may include upper heatsinks and lower heatsinks. the enclosed heatsink architectures may reduce device overheating and time spent in thermal throttling, as well as improve the life expectancy, durability, efficiency, and performance of the memory devices. increased efficiency in cooling the device may save energy costs.
