Micron technology, inc. (20240194630). BONDABLE PILLARS FOR WIRE BONDS IN A SEMICONDUCTOR PACKAGE simplified abstract
Contents
BONDABLE PILLARS FOR WIRE BONDS IN A SEMICONDUCTOR PACKAGE
Organization Name
Inventor(s)
See Hiong Leow of Singapore (SG)
Kelvin Aik Boo Tan of Singapore (SG)
BONDABLE PILLARS FOR WIRE BONDS IN A SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240194630 titled 'BONDABLE PILLARS FOR WIRE BONDS IN A SEMICONDUCTOR PACKAGE
Simplified Explanation: The patent application describes a semiconductor device assembly that includes a substrate with multiple first electrical contacts and bondable pillars, where each bondable pillar is connected to a corresponding first electrical contact. The assembly also includes one or more dies with multiple second electrical contacts, and multiple wire bonds connecting the second electrical contacts to the bondable pillars.
- The semiconductor device assembly includes a substrate with multiple first electrical contacts and bondable pillars.
- Each bondable pillar is connected to a corresponding first electrical contact on the substrate.
- One or more dies are attached to the substrate and have multiple second electrical contacts.
- Multiple wire bonds connect the second electrical contacts on the dies to the bondable pillars on the substrate.
Potential Applications: This technology could be used in various semiconductor devices such as integrated circuits, sensors, and microprocessors.
Problems Solved: This technology provides a reliable and efficient way to connect dies to substrates in semiconductor device assemblies.
Benefits: The technology allows for secure electrical connections between dies and substrates, improving the overall performance and reliability of semiconductor devices.
Commercial Applications: This technology could be valuable in the semiconductor industry for manufacturing high-performance electronic devices with improved connectivity and reliability.
Prior Art: Prior art related to this technology may include patents or research papers on semiconductor device assembly techniques and wire bonding methods.
Frequently Updated Research: Researchers may be exploring new materials and processes to further enhance the performance and reliability of semiconductor device assemblies using similar concepts.
Questions about Semiconductor Device Assemblies: 1. How does this technology improve the reliability of semiconductor devices? 2. What are the potential cost implications of implementing this technology in semiconductor manufacturing processes?
Original Abstract Submitted
implementations described herein relate to various semiconductor device assemblies. in some implementations, a semiconductor device assembly may include a substrate including multiple first electrical contacts and multiple bondable pillars. in some implementations, each bondable pillar, of the multiple bondable pillars, may be coupled to a corresponding first electrical contact, of the multiple first electrical contacts. the semiconductor device assembly may further include one or more dies coupled to the substrate and including multiple second electrical contacts. in some implementations, the semiconductor device assembly may include multiple wire bonds, with each wire bond, of the multiple wire bonds, bonding a second electrical contact, of the multiple second electrical contacts, to a bondable pillar, of the multiple bondable pillars.
