Micron technology, inc. (20240194565). COOLING SYSTEM FOR A SEMICONDUCTOR DEVICE ASSEMBLY simplified abstract
Contents
COOLING SYSTEM FOR A SEMICONDUCTOR DEVICE ASSEMBLY
Organization Name
Inventor(s)
Ravi Kumar Kollipara of Puppalaguda (IN)
Suresh Reddy Yarragunta of Bangalore (IN)
COOLING SYSTEM FOR A SEMICONDUCTOR DEVICE ASSEMBLY - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240194565 titled 'COOLING SYSTEM FOR A SEMICONDUCTOR DEVICE ASSEMBLY
The semiconductor device assembly described in the abstract includes a cooling system that enables heat transfer from the semiconductor die to a fluid flowing through a channel at the back side of the die. The fluid is received through an inlet, flows through the channel, and is expelled through an outlet, providing an efficient cooling solution for the assembly.
- The semiconductor device assembly includes a cooling system with a channel for fluid flow.
- Heat is transferred from the semiconductor die to the fluid flowing through the channel.
- The fluid is received through an inlet and expelled through an outlet.
- This cooling system is compact and effective for cooling the semiconductor device assembly.
Potential Applications: - This technology can be applied in various semiconductor devices to improve thermal management. - It can be used in high-performance computing systems, servers, and other electronics that require efficient cooling.
Problems Solved: - Addresses the issue of heat dissipation in semiconductor devices. - Provides a compact and effective cooling solution for improved performance and reliability.
Benefits: - Enhanced thermal management for semiconductor devices. - Improved performance and reliability due to efficient cooling. - Compact design for space-constrained applications.
Commercial Applications: Title: "Efficient Cooling System for Semiconductor Devices" This technology can be commercialized for: - Electronics manufacturers looking to enhance thermal management in their products. - Companies producing high-performance computing systems and servers. - Semiconductor industry for improving the reliability and performance of their devices.
Prior Art: Readers can explore prior art related to cooling systems for semiconductor devices in patents and research papers related to thermal management in electronics.
Frequently Updated Research: Stay updated on the latest advancements in cooling technologies for semiconductor devices to ensure optimal performance and reliability.
Questions about Semiconductor Device Cooling Systems: 1. How does the fluid flow through the channel help in cooling the semiconductor die? 2. What are the key advantages of using a cooling system in semiconductor device assemblies?
Original Abstract Submitted
a semiconductor device assembly is provided that includes a cooling system. the semiconductor device assembly includes a semiconductor die assembled onto a substrate. a channel is disposed at a back side of the semiconductor die to enable fluid to flow through the channel and cause heat to transfer from the semiconductor die to the fluid. the fluid is received through an inlet to enable the fluid to be flowed through the channel. after the fluid is flowed through the channel, the fluid is expelled through an outlet. in this way, a compact and effective cooling system for a semiconductor device assembly may be implemented.
