Micron technology, inc. (20240194549). SEMICONDUCTOR DEVICE ASSEMBLIES WITH AN ENCAPSULANT MATERIAL HAVING ENHANCED THERMAL CONDUCTIVITY, AND METHODS FOR MAKING THE SAME simplified abstract
SEMICONDUCTOR DEVICE ASSEMBLIES WITH AN ENCAPSULANT MATERIAL HAVING ENHANCED THERMAL CONDUCTIVITY, AND METHODS FOR MAKING THE SAME
Organization Name
Inventor(s)
Min Hua Chung of Taichung (TW)
Chong Leong Gan of Taichung (TW)
SEMICONDUCTOR DEVICE ASSEMBLIES WITH AN ENCAPSULANT MATERIAL HAVING ENHANCED THERMAL CONDUCTIVITY, AND METHODS FOR MAKING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240194549 titled 'SEMICONDUCTOR DEVICE ASSEMBLIES WITH AN ENCAPSULANT MATERIAL HAVING ENHANCED THERMAL CONDUCTIVITY, AND METHODS FOR MAKING THE SAME
Simplified Explanation: The patent application describes a semiconductor device assembly consisting of a support layer, a semiconductor device, and an encapsulant material. The encapsulant material contains thermally conductive nanoparticles with an electrically insulative shell and an electrically conductive core, evenly distributed throughout the bulk material, encapsulating the semiconductor device.
- The assembly includes a support layer with an inside surface.
- A semiconductor device is placed on the inside surface of the support layer.
- The encapsulant material comprises thermally conductive nanoparticles with an insulative shell and a conductive core.
- The nanoparticles are evenly dispersed in the bulk material.
- The encapsulant material at least partially encapsulates the semiconductor device.
Potential Applications: This technology can be applied in various electronic devices, such as computers, smartphones, and automotive electronics, to improve thermal management and overall performance.
Problems Solved: The technology addresses the challenge of efficiently dissipating heat generated by semiconductor devices, which can improve their reliability and longevity.
Benefits: - Enhanced thermal conductivity - Improved device performance and reliability - Extended device lifespan
Commercial Applications: Potential commercial applications include the electronics industry, specifically in the manufacturing of high-performance electronic devices where thermal management is crucial for optimal operation.
Prior Art: Readers can explore prior patents related to semiconductor device encapsulation and thermal management technologies to gain a deeper understanding of the innovation presented in this patent application.
Frequently Updated Research: Researchers are continually exploring new materials and techniques to enhance the thermal conductivity of encapsulant materials in semiconductor devices for improved performance and reliability.
Questions about Semiconductor Device Assembly: 1. What are the key advantages of using thermally conductive nanoparticles in encapsulant materials for semiconductor devices? 2. How does the distribution of nanoparticles in the bulk material impact the thermal management of the semiconductor device?
Original Abstract Submitted
a semiconductor device assembly is provided. the assembly includes a support layer with an inside surface, a semiconductor device, and an encapsulant material. the encapsulant material includes a bulk material and thermally conductive nanoparticles, each nanoparticle having an electrically insulative shell and an electrically conductive core. the semiconductor device is disposed on the inside surface of the support layer, the thermally conductive nanoparticles are evenly distributed throughout the bulk material, and the encapsulant material at least partially encapsulates the semiconductor device.
