Micron technology, inc. (20240194287). REPAIR TECHNIQUES FOR COUPLED MEMORY DIES simplified abstract
Contents
REPAIR TECHNIQUES FOR COUPLED MEMORY DIES
Organization Name
Inventor(s)
James Brian Johnson of Boise ID (US)
Kunal R. Parekh of Boise ID (US)
Eiichi Nakano of Boise ID (US)
Amy Rae Griffin of Boise ID (US)
REPAIR TECHNIQUES FOR COUPLED MEMORY DIES - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240194287 titled 'REPAIR TECHNIQUES FOR COUPLED MEMORY DIES
Simplified Explanation: The patent application describes methods, systems, and devices for repair techniques for coupled host and memory dies, where memory access circuitry is distributed among multiple semiconductor dies in a stack.
Key Features and Innovation:
- Memory access circuitry distributed among multiple semiconductor dies in a stack.
- First die includes memory arrays and circuitry to access them, while the second die includes circuitry to support repair techniques for memory operations.
- Repair techniques for column failures, serialization failures, contact failures, and interconnection failures between dies.
Potential Applications: This technology could be applied in the semiconductor industry for improving memory access and repair capabilities in stacked dies.
Problems Solved: This technology addresses issues related to memory failures, such as column failures, serialization failures, contact failures, and interconnection failures between dies in a stack.
Benefits:
- Enhanced memory access and repair capabilities.
- Improved reliability and performance of memory operations in stacked dies.
Commercial Applications: Potential commercial applications include the manufacturing of advanced memory devices for various electronic products, such as smartphones, tablets, and computers.
Prior Art: Readers can explore prior patents related to memory repair techniques in stacked dies to understand the evolution of this technology.
Frequently Updated Research: Stay updated on research related to memory repair techniques in semiconductor devices to leverage the latest advancements in the field.
Questions about memory repair techniques in stacked dies: 1. What are the key challenges in implementing repair techniques for memory operations in stacked dies? 2. How do repair techniques for memory failures impact the overall performance and reliability of semiconductor devices?
Original Abstract Submitted
methods, systems, and devices for repair techniques for coupled host and memory dies are described. for example, to distribute memory access circuitry among multiple semiconductor dies of a stack, a first die may include a set of one or more memory arrays and a first portion of circuitry configured to access the set of memory arrays, and a second die may include a second portion of circuitry configured to access the set of memory arrays. the second portion of the circuitry (e.g., of the second die) may be configured to support various repair techniques for operations with the set of memory arrays, including techniques in response to column failures or serialization failures associated with the first die, or in response to contact or other interconnection failures with or between the first die and the second die, among other techniques that may be differentiated based on an attribution of error conditions.
