Micron technology, inc. (20240186274). TECHNIQUES FOR THERMAL DISTRIBUTION IN COUPLED SEMICONDUCTOR SYSTEMS simplified abstract
Contents
TECHNIQUES FOR THERMAL DISTRIBUTION IN COUPLED SEMICONDUCTOR SYSTEMS
Organization Name
Inventor(s)
Amy Rae Griffin of Boise ID (US)
Kunal R. Parekh of Boise ID (US)
Eiichi Nakano of Boise ID (US)
James Brian Johnson of Boise ID (US)
Ameen D. Akel of Rancho Cordova CA (US)
TECHNIQUES FOR THERMAL DISTRIBUTION IN COUPLED SEMICONDUCTOR SYSTEMS - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240186274 titled 'TECHNIQUES FOR THERMAL DISTRIBUTION IN COUPLED SEMICONDUCTOR SYSTEMS
Simplified Explanation: The patent application describes methods, systems, and devices for thermal distribution techniques in coupled semiconductor systems. These systems involve coupling various semiconductor components together and utilizing a semiconductor material to support a thermal path with high thermal conductivity.
- The semiconductor system includes coupled semiconductor components and a semiconductor material with high thermal conductivity.
- The semiconductor material may be located in regions of the system without functional semiconductor components.
- The semiconductor material may be electrically inoperable and directly coupled with semiconductor components using bonding techniques.
Key Features and Innovation:
- Coupled semiconductor systems with thermal distribution techniques.
- Use of semiconductor material with high thermal conductivity to support thermal paths.
- Semiconductor material located in regions without functional semiconductor components.
- Electrically inoperable semiconductor material directly coupled with semiconductor components.
Potential Applications: The technology can be applied in various semiconductor systems requiring efficient thermal distribution, such as in high-performance computing, telecommunications, and automotive electronics.
Problems Solved: The technology addresses the challenge of managing heat dissipation in coupled semiconductor systems, ensuring optimal performance and reliability of the components.
Benefits:
- Improved thermal management in semiconductor systems.
- Enhanced performance and reliability of semiconductor components.
- Efficient heat dissipation for high-power applications.
Commercial Applications: "Thermal Distribution Techniques in Coupled Semiconductor Systems: Market Implications and Commercial Uses"
The technology has potential commercial applications in industries such as data centers, telecommunications infrastructure, and electric vehicles where efficient thermal management is crucial for performance and longevity.
Prior Art: There is limited prior art on the specific combination of thermal distribution techniques and semiconductor coupling described in this patent application.
Frequently Updated Research: No information on frequently updated research related to this technology is available at this time.
Questions about Thermal Distribution Techniques in Coupled Semiconductor Systems: 1. How does the use of a semiconductor material with high thermal conductivity improve the performance of coupled semiconductor systems? 2. What are the potential challenges in implementing these thermal distribution techniques in real-world semiconductor applications?
Original Abstract Submitted
methods, systems, and devices for thermal distribution techniques in coupled semiconductor systems are described. a semiconductor system may be formed by coupling various semiconductor components with one another, and may also implement a semiconductor material to support a thermal path having a thermal conductivity that is relatively close to a thermal conductivity through the coupled semiconductor components of the semiconductor system. such a semiconductor material may be located in regions of the semiconductor system that are otherwise unoccupied by functional (e.g., electrically operable) semiconductor components and may, in some examples, be electrically inoperable (e.g., may lack functional circuitry). for implementations in which functional semiconductor components are directly coupled (e.g., by fusion bonding or hybrid bonding techniques), the semiconductor material may also be directly coupled with at least one of the semiconductor components.
