Micron technology, inc. (20240186239). MICROELECTRONIC DEVICES WITH MULTIPLE STEP CONTACTS EXTENDING TO STEPPED TIERS, AND RELATED METHODS simplified abstract
MICROELECTRONIC DEVICES WITH MULTIPLE STEP CONTACTS EXTENDING TO STEPPED TIERS, AND RELATED METHODS
Organization Name
Inventor(s)
Shuangqiang Luo of Boise ID (US)
MICROELECTRONIC DEVICES WITH MULTIPLE STEP CONTACTS EXTENDING TO STEPPED TIERS, AND RELATED METHODS - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240186239 titled 'MICROELECTRONIC DEVICES WITH MULTIPLE STEP CONTACTS EXTENDING TO STEPPED TIERS, AND RELATED METHODS
Simplified Explanation: The patent application describes microelectronic devices with a unique stack structure that includes alternating insulative and conductive structures, some of which form staircase-like features. These devices have step contacts that extend to the steps of the staircase, providing multiple contact points for the conductive structures.
- The microelectronic devices have a stack structure with insulative and conductive structures arranged in tiers.
- Some structures within the stack have staircase features made of conductive structures.
- Step contacts extend to the steps of the staircase, providing multiple contact points for the conductive structures.
- The design allows for efficient electrical connections within the device.
Potential Applications: This technology could be used in various electronic systems requiring precise and efficient electrical connections, such as integrated circuits, sensors, and memory devices.
Problems Solved: This innovation addresses the need for improved electrical connectivity and efficiency in microelectronic devices, enhancing their overall performance and reliability.
Benefits: The benefits of this technology include enhanced electrical connectivity, improved device performance, and increased reliability in microelectronic systems.
Commercial Applications: Potential commercial applications of this technology include the semiconductor industry, electronics manufacturing, and research and development of advanced electronic devices.
Prior Art: No specific information on prior art related to this technology is provided in the abstract.
Frequently Updated Research: There is no information on frequently updated research related to this technology in the abstract.
Questions about Microelectronic Devices with Staircase Features: Question 1: How does the staircase design improve the electrical connections in microelectronic devices? Answer: The staircase design provides multiple contact points for the conductive structures, enhancing electrical connectivity within the device.
Question 2: What are some potential challenges in implementing the staircase features in microelectronic devices? Answer: Some potential challenges could include precise fabrication of the staircase structures and ensuring uniform contact points for the conductive structures.
Original Abstract Submitted
microelectronic devices include a stack structure having a vertically alternating sequence of insulative structures and conductive structures arranged in tiers. at least one stadium, of stadiums within the stack structure, comprise staircase(s) having steps provided by a group of the conductive structures. step contacts extend to the steps of the staircase(s) of the at least one of the stadiums. each conductive structure of the group of conductive structures has more than one of the step contacts in contact therewith at at least one of the steps of the staircase(s). additional microelectronic devices are also disclosed, as are methods of fabrication and electronic systems.
