Micron technology, inc. (20240179894). METAL SENSE LINE CONTACT simplified abstract
Contents
- 1 METAL SENSE LINE CONTACT
METAL SENSE LINE CONTACT
Organization Name
Inventor(s)
Ping Chieh Chiang of Boise ID (US)
METAL SENSE LINE CONTACT - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240179894 titled 'METAL SENSE LINE CONTACT
Simplified Explanation
The patent application describes methods, apparatuses, and systems related to a metal sense line contact. An example apparatus includes a sense line pillar with multiple layers of materials, including a barrier material, liner material, first metal material, second metal material, and cap material. The apparatus also includes cell contacts between a plurality of sense line pillars.
- The apparatus includes a sense line pillar with multiple layers of materials.
- The sense line pillar has a barrier material, liner material, first metal material, second metal material, and cap material.
- Cell contacts are present between a plurality of sense line pillars.
Potential Applications
This technology could be applied in semiconductor manufacturing, specifically in the development of metal sense line contacts for improved performance and reliability.
Problems Solved
This technology solves the problem of ensuring proper contact between sense line pillars in semiconductor devices, which is crucial for accurate sensing and data processing.
Benefits
The benefits of this technology include enhanced performance, increased reliability, and improved functionality of semiconductor devices with metal sense line contacts.
Potential Commercial Applications
"Metal Sense Line Contact Technology for Semiconductor Devices" could be used in the production of advanced electronic devices, such as smartphones, tablets, and computers, to enhance their performance and reliability.
Possible Prior Art
One possible prior art for this technology could be the development of metal contacts in semiconductor devices to improve conductivity and signal transmission.
Unanswered Questions
How does this technology compare to existing metal sense line contact solutions in terms of performance and reliability?
This article does not provide a direct comparison with existing solutions in the market.
What are the potential challenges in implementing this technology on a large scale in semiconductor manufacturing processes?
The article does not address the potential challenges in scaling up the production of semiconductor devices with this technology.
Original Abstract Submitted
methods, apparatuses, and systems related to a metal sense line contact are described. an example apparatus includes a sense line pillar comprising a barrier material over a semiconductor substrate. the sense line pillar further includes a liner material adjacent the barrier material. the sense line pillar further includes a first metal material over the barrier material. the sense line pillar further includes a second metal material over the first metal material. the sense line pillar further includes a cap material over the second metal material. the apparatus further cell contacts between a plurality of sense line pillars.
