Micron technology, inc. (20240179873). HEAT TRANSFER DEVICES FOR ENHANCED THERMAL PERFORMANCE OF ELECTRONIC SYSTEMS simplified abstract
Contents
- 1 HEAT TRANSFER DEVICES FOR ENHANCED THERMAL PERFORMANCE OF ELECTRONIC SYSTEMS
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 HEAT TRANSFER DEVICES FOR ENHANCED THERMAL PERFORMANCE OF ELECTRONIC SYSTEMS - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
HEAT TRANSFER DEVICES FOR ENHANCED THERMAL PERFORMANCE OF ELECTRONIC SYSTEMS
Organization Name
Inventor(s)
Ravi Kumar Kollipara of Puppalaguda (IN)
Deepu Narasimiah Subhash of Yeshwanthpur (IN)
Suresh Reddy Yarragunta of RR Nagar (IN)
HEAT TRANSFER DEVICES FOR ENHANCED THERMAL PERFORMANCE OF ELECTRONIC SYSTEMS - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240179873 titled 'HEAT TRANSFER DEVICES FOR ENHANCED THERMAL PERFORMANCE OF ELECTRONIC SYSTEMS
Simplified Explanation
The patent application describes a system with a circuit, components, an enclosure, and a heat transfer device. The heat transfer device has different portions on its exterior and interior surfaces, designed to couple with the top and bottom of the enclosure, as well as with components on a circuit board to distribute thermal energy efficiently.
- The heat transfer device has multiple portions on its exterior and interior surfaces.
- The first portion of the heat transfer device is designed to couple with the top of the enclosure.
- The second portion of the heat transfer device is designed to couple with the bottom of the enclosure.
- The fourth portion of the heat transfer device is configured to couple with a component mounted on the primary side of the circuit board.
- The fifth portion of the heat transfer device is designed to face the secondary side of the circuit board.
- The heat transfer device efficiently distributes thermal energy generated from a component to the top and bottom of the enclosure.
Potential Applications
This technology could be applied in electronic devices, such as computers, servers, and other systems where efficient heat dissipation is crucial.
Problems Solved
This technology solves the problem of overheating in electronic devices by providing an effective heat transfer mechanism to dissipate thermal energy.
Benefits
The benefits of this technology include improved thermal management, increased component lifespan, and enhanced overall performance of electronic devices.
Potential Commercial Applications
The potential commercial applications of this technology include consumer electronics, industrial equipment, and telecommunications systems.
Possible Prior Art
One possible prior art for this technology could be similar heat transfer devices used in electronic devices or industrial machinery to manage thermal energy efficiently.
Unanswered Questions
How does this technology compare to traditional cooling methods?
This article does not provide a direct comparison between this innovative heat transfer device and traditional cooling methods. It would be interesting to know the efficiency and cost-effectiveness of this technology compared to conventional cooling systems.
Are there any limitations to the size or type of components that can be effectively cooled using this technology?
The article does not address any potential limitations regarding the size or type of components that can benefit from this heat transfer device. Understanding any restrictions in application could be crucial for potential users or manufacturers.
Original Abstract Submitted
a system with a circuit with components, an enclosure with a top and a bottom, and a heat transfer device. the heat transfer device has an exterior surface with a first portion, a second portion, and a third portion, where the first portion faces opposite the second portion; and an interior surface with a fourth portion, a fifth portion, and a sixth portion, where the fourth portion faces the fifth portion. the first portion configured to thermally couple to the top of the enclosure. the second portion configured to thermally couple to the bottom of the enclosure. the fourth portion configured to couple to a component mounted on a primary side of the circuit board. the fifth portion configured to face a secondary side of the circuit board. the first heat transfer device configured to distribute thermal energy generated from a component to the top and bottom of the enclosure.
