Micron technology, inc. (20240178272). SEMICONDUCTOR STRUCTURE WITH CURVED SURFACES simplified abstract
Contents
- 1 SEMICONDUCTOR STRUCTURE WITH CURVED SURFACES
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 SEMICONDUCTOR STRUCTURE WITH CURVED SURFACES - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Original Abstract Submitted
SEMICONDUCTOR STRUCTURE WITH CURVED SURFACES
Organization Name
Inventor(s)
SEMICONDUCTOR STRUCTURE WITH CURVED SURFACES - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240178272 titled 'SEMICONDUCTOR STRUCTURE WITH CURVED SURFACES
Simplified Explanation
The patent application describes methods, apparatuses, and systems related to semiconductor structures with curved surfaces. An example apparatus includes a semiconductor structure with patterned material comprising active areas, conductive materials, metal materials, nitride materials, and oxide materials. The apparatus also features a curved surface formed on a portion of the metal material and nitride material, as well as additional layers of oxide material and metal material on the patterned material.
- Semiconductor structure with patterned material
- Active areas with conductive and metal materials
- Nitride materials separating different components
- Curved surface on metal and nitride materials
- Additional layers of oxide and metal materials
Potential Applications
The technology described in the patent application could be applied in the manufacturing of advanced semiconductor devices, such as curved displays, sensors, and integrated circuits.
Problems Solved
This technology solves the problem of integrating curved surfaces into semiconductor structures, allowing for more versatile and efficient device designs.
Benefits
The benefits of this technology include improved performance, increased design flexibility, and enhanced durability of semiconductor devices with curved surfaces.
Potential Commercial Applications
The potential commercial applications of this technology include consumer electronics, automotive electronics, medical devices, and industrial equipment.
Possible Prior Art
One possible prior art for this technology could be the use of curved surfaces in semiconductor devices, but the specific combination of materials and structures described in the patent application may be novel.
What materials are used in the patterned material of the semiconductor structure?
The patterned material of the semiconductor structure includes active areas, conductive materials, metal materials, nitride materials, and oxide materials.
How does the curved surface on the metal and nitride materials contribute to the functionality of the semiconductor structure?
The curved surface on the metal and nitride materials allows for more efficient heat dissipation and improved electrical performance in the semiconductor structure.
Original Abstract Submitted
methods, apparatuses, and systems related to semiconductor structure with curved surfaces are described. an example apparatus includes a semiconductor structure comprising a patterned material comprising active areas, a first conductive material on a surface of each active area, and a first metal material on a surface of each first conductive material. the patterned material further includes a second and third conductive material, a first nitride material, and a second nitride material separating each active area, first conductive material, and first metal material from each second and third conductive material, and first nitride material. the apparatus includes a curved surface formed on a portion of the first metal material and second nitride material. the apparatus further includes a first layer comprising an oxide material and a second metal material on the patterned material, where the oxide material contacts the curved surface.
