Micron technology, inc. (20240177743). METHODS FOR OPTIMIZING SEMICONDUCTOR DEVICE PLACEMENT ON A SUBSTRATE FOR IMPROVED PERFORMANCE, AND ASSOCIATED SYSTEMS AND METHODS simplified abstract
Contents
- 1 METHODS FOR OPTIMIZING SEMICONDUCTOR DEVICE PLACEMENT ON A SUBSTRATE FOR IMPROVED PERFORMANCE, AND ASSOCIATED SYSTEMS AND METHODS
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 METHODS FOR OPTIMIZING SEMICONDUCTOR DEVICE PLACEMENT ON A SUBSTRATE FOR IMPROVED PERFORMANCE, AND ASSOCIATED SYSTEMS AND METHODS - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Original Abstract Submitted
METHODS FOR OPTIMIZING SEMICONDUCTOR DEVICE PLACEMENT ON A SUBSTRATE FOR IMPROVED PERFORMANCE, AND ASSOCIATED SYSTEMS AND METHODS
Organization Name
Inventor(s)
James S. Rehmeyer of Boise ID (US)
Christopher G. Wieduwilt of Boise ID (US)
METHODS FOR OPTIMIZING SEMICONDUCTOR DEVICE PLACEMENT ON A SUBSTRATE FOR IMPROVED PERFORMANCE, AND ASSOCIATED SYSTEMS AND METHODS - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240177743 titled 'METHODS FOR OPTIMIZING SEMICONDUCTOR DEVICE PLACEMENT ON A SUBSTRATE FOR IMPROVED PERFORMANCE, AND ASSOCIATED SYSTEMS AND METHODS
Simplified Explanation
The abstract describes a method of optimizing the placement of memories in a memory device based on their ability to process signals from an electrical component. Memories are tested and labeled with different labels indicating their processing capabilities, and then positioned on the substrate accordingly.
- Testing memories to determine their ability to process signals from an electrical component.
- Labeling memories based on their processing capabilities with different labels.
- Positioning memories on the substrate based on their labels, with closer placement for memories with lower processing capabilities.
Potential Applications
The optimized placement of memories in a memory device can be applied in various electronic devices such as smartphones, computers, and IoT devices to improve overall performance and efficiency.
Problems Solved
This technology solves the problem of inefficient memory placement in memory devices, ensuring that memories with different processing capabilities are positioned optimally to enhance signal processing.
Benefits
- Improved signal processing efficiency - Enhanced overall performance of electronic devices - Better utilization of memory resources
Potential Commercial Applications
"Optimized Memory Placement Technology for Enhanced Signal Processing" can find applications in the semiconductor industry, memory device manufacturing, and electronic device production for improved product performance and reliability.
Possible Prior Art
One possible prior art could be the optimization of memory placement based on signal processing capabilities in memory devices, but the specific method of testing, labeling, and positioning memories as described in this patent application may be novel.
Unanswered Questions
How does this technology impact the overall cost of memory devices?
The abstract does not provide information on whether this optimized memory placement technique affects the cost of memory devices. Further research or analysis would be needed to determine the cost implications of implementing this technology.
What are the potential challenges in implementing this optimized memory placement method on a large scale?
The abstract does not address the potential challenges that may arise when implementing this optimized memory placement method on a large scale. Factors such as scalability, manufacturing processes, and compatibility with existing technologies could be significant considerations that need to be explored further.
Original Abstract Submitted
methods of optimizing the placement of memories in a memory device including a substrate and an electrical component, and associated devices and systems, are disclosed herein. a representative method includes first testing the memories to determine at least one parameter for each of the memories indicating an ability of the memory to process signals from the electrical component. the method can further include labeling each memory with a label based on the parameter, the labels including at least a first label and a second label. the first label can indicate that the memories with the first label are better able to process signals from the electrical component than the memories with the second label. the method can further include electrically coupling the memories to the substrate such that the memories with the second label are positioned closer to the electrical component than the memories with the first label.
