Micron technology, inc. (20240176523). TECHNIQUES FOR COUPLED HOST AND MEMORY DIES simplified abstract
Contents
TECHNIQUES FOR COUPLED HOST AND MEMORY DIES
Organization Name
Inventor(s)
James Brian Johnson of Boise ID (US)
Kunal R. Parekh of Boise ID (US)
Eiichi Nakano of Boise ID (US)
Amy Rae Griffin of Boise ID (US)
Ameen D. Akel of Rancho Cordova CA (US)
TECHNIQUES FOR COUPLED HOST AND MEMORY DIES - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240176523 titled 'TECHNIQUES FOR COUPLED HOST AND MEMORY DIES
Simplified Explanation
The patent application describes methods, systems, and devices for techniques for coupled host and memory dies. This involves distributing memory access circuitry among multiple semiconductor dies of a stack, where one die includes memory arrays and a portion of the circuitry to access them, while another die includes the remaining portion of the circuitry to access the memory arrays. The circuitry on each die is communicatively coupled using various interconnection techniques, such as a fusion of conductive contacts.
- Memory access circuitry distributed among multiple semiconductor dies
- First die includes memory arrays and a portion of the circuitry to access them
- Second die includes the remaining portion of the circuitry to access the memory arrays
- Circuitry on each die communicatively coupled using interconnection techniques
- Potential applications of this technology
- Problems solved by this technology
- Benefits of this technology
- Potential commercial applications of this technology
- Possible prior art
- Potential Applications
The technology described in the patent application could be applied in high-performance computing systems, data centers, and other memory-intensive applications where efficient memory access is crucial.
- Problems Solved
This technology solves the problem of efficiently distributing memory access circuitry among multiple semiconductor dies in a stack, improving overall system performance and scalability.
- Benefits
The benefits of this technology include enhanced memory access efficiency, increased system performance, and improved scalability for memory-intensive applications.
- Potential Commercial Applications
The technology could find commercial applications in the development of advanced computing systems, servers, and data storage solutions that require high-speed and efficient memory access.
- Possible Prior Art
One possible prior art could be the use of stacked memory dies with separate memory access circuitry on each die, but without the specific techniques for distributing and coupling the circuitry described in this patent application.
- Unanswered Questions
- How does this technology compare to existing memory access solutions in terms of performance and scalability?
This article does not provide a direct comparison with existing memory access solutions in terms of performance and scalability.
- What are the potential challenges or limitations of implementing this technology in practical applications?
The article does not address the potential challenges or limitations of implementing this technology in practical applications.
Original Abstract Submitted
methods, systems, and devices for techniques for coupled host and memory dies are described. for example, to distribute memory access circuitry among multiple semiconductor dies of a stack, a first die may include a set of one or more memory arrays and a first portion of the circuitry configured to access the set of memory arrays, and a second die may include a second portion of the circuitry configured to access the set of memory arrays. the first portion and the second portion of the circuitry configured to access a set of memory arrays may be communicatively coupled between the dies using various interconnection techniques, such as a fusion of conductive contacts of the respective memory dies. in some examples, the second die may also include the host itself (e.g., a host processor).
