Micron technology, inc. (20240162207). PASSIVE ELECTRONIC COMPONENTS ON A SEMICONDUCTOR DIE simplified abstract
Contents
- 1 PASSIVE ELECTRONIC COMPONENTS ON A SEMICONDUCTOR DIE
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 PASSIVE ELECTRONIC COMPONENTS ON A SEMICONDUCTOR DIE - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Original Abstract Submitted
PASSIVE ELECTRONIC COMPONENTS ON A SEMICONDUCTOR DIE
Organization Name
Inventor(s)
Kelvin Aik Boo Tan of Singapore (SG)
See Hiong Leow of Singapore (SG)
PASSIVE ELECTRONIC COMPONENTS ON A SEMICONDUCTOR DIE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240162207 titled 'PASSIVE ELECTRONIC COMPONENTS ON A SEMICONDUCTOR DIE
Simplified Explanation
The patent application describes semiconductor device assemblies, specifically a semiconductor package with a substrate, a semiconductor die, and a passive electronic component on the die.
- Semiconductor package includes a substrate, semiconductor die, and passive electronic component.
- Passive electronic component is disposed on the semiconductor die.
Potential Applications
This technology could be applied in various electronic devices such as smartphones, tablets, laptops, and other consumer electronics.
Problems Solved
This technology helps in improving the performance and functionality of semiconductor devices by integrating passive electronic components directly onto the semiconductor die.
Benefits
1. Enhanced performance and functionality of semiconductor devices. 2. Compact design leading to space-saving in electronic devices. 3. Improved reliability and durability of semiconductor packages.
Potential Commercial Applications
"Integration of Passive Electronic Components on Semiconductor Die: Advantages and Applications"
Possible Prior Art
There are existing patents related to semiconductor packaging and integration of passive electronic components, but specific prior art is not provided in this context.
Unanswered Questions
How does this technology impact the overall cost of semiconductor devices?
The cost implications of integrating passive electronic components on the semiconductor die are not discussed in the abstract. It would be interesting to know if this technology leads to cost savings or increased manufacturing expenses.
What are the potential challenges in implementing this technology on a large scale?
The abstract does not mention any challenges associated with integrating passive electronic components on the semiconductor die. Understanding the potential hurdles in mass production and scalability of this technology would provide a more comprehensive view of its feasibility.
Original Abstract Submitted
implementations described herein relate to various semiconductor device assemblies. in some implementations, a semiconductor package includes a substrate, a semiconductor die disposed on the substrate, and a passive electronic component disposed on the semiconductor die.
