Micron technology, inc. (20240162206). LOAD SWITCH MOUNTING FOR A SEMICONDUCTOR PACKAGE simplified abstract
Contents
- 1 LOAD SWITCH MOUNTING FOR A SEMICONDUCTOR PACKAGE
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 LOAD SWITCH MOUNTING FOR A SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Original Abstract Submitted
LOAD SWITCH MOUNTING FOR A SEMICONDUCTOR PACKAGE
Organization Name
Inventor(s)
Kelvin Aik Boo Tan of Singapore (SG)
See Hiong Leow of Singapore (SG)
LOAD SWITCH MOUNTING FOR A SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240162206 titled 'LOAD SWITCH MOUNTING FOR A SEMICONDUCTOR PACKAGE
Simplified Explanation
The patent application describes a semiconductor device assembly with a substrate, multiple electrical contacts, a load switch, and wire bonds for electrical coupling.
- The semiconductor device assembly includes a substrate with multiple first electrical contacts.
- A load switch is coupled to the substrate, with multiple second electrical contacts on its outer surface.
- Wire bonds electrically couple the load switch to the substrate, connecting corresponding first and second electrical contacts.
Potential Applications
This technology could be applied in various semiconductor devices, such as power management systems, integrated circuits, and electronic control units.
Problems Solved
This innovation solves the problem of efficiently connecting a load switch to a substrate in a semiconductor device assembly, ensuring reliable electrical connections.
Benefits
The benefits of this technology include improved performance, increased reliability, and simplified manufacturing processes for semiconductor device assemblies.
Potential Commercial Applications
This technology has potential commercial applications in industries such as electronics, automotive, telecommunications, and consumer electronics.
Possible Prior Art
One possible prior art for this technology could be similar semiconductor device assemblies with wire bonds for electrical coupling, but with different configurations or materials.
Unanswered Questions
How does this technology compare to existing methods of connecting load switches in semiconductor device assemblies?
This technology offers a more efficient and reliable way to connect load switches to substrates, but it would be beneficial to compare its performance and cost-effectiveness to other existing methods.
What are the specific design considerations for implementing this technology in different types of semiconductor devices?
It would be important to understand the specific design requirements and constraints for integrating this technology into various semiconductor devices, considering factors such as size, power requirements, and operating conditions.
Original Abstract Submitted
implementations described herein relate to various semiconductor device assemblies. in some implementations, a semiconductor device assembly may include a substrate and multiple first electrical contacts disposed on the substrate. the semiconductor device assembly may include a load switch coupled to the substrate and including a first outer surface facing the substrate and an opposing second outer surface facing away from the substrate. the load switch may include multiple second electrical contacts disposed on the second outer surface. the semiconductor device assembly may include multiple wire bonds electrically coupling the load switch to the substrate, wherein each wire bond electrically couples a corresponding first electrical contact, of the multiple first electrical contacts, to a corresponding second electrical contact, of the multiple second electrical contacts.
