Micron technology, inc. (20240162154). SEMICONDUCTOR DEVICE HAVING CONTACT PLUG simplified abstract
Contents
- 1 SEMICONDUCTOR DEVICE HAVING CONTACT PLUG
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 SEMICONDUCTOR DEVICE HAVING CONTACT PLUG - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
SEMICONDUCTOR DEVICE HAVING CONTACT PLUG
Organization Name
Inventor(s)
KEIICHI Tsuchiya of Higashihiroshima (JP)
KEIZO Kawakita of Higashihiroshima (JP)
SEMICONDUCTOR DEVICE HAVING CONTACT PLUG - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240162154 titled 'SEMICONDUCTOR DEVICE HAVING CONTACT PLUG
Simplified Explanation
The patent application describes an apparatus with two conductive patterns at different wiring layers connected by a contact plug, where the upper conductive section of the plug is narrower than the lower conductive section in one direction.
- The apparatus includes a first conductive pattern at a lower wiring layer and a second conductive pattern at a higher wiring layer.
- A contact plug connects the two patterns, with a narrower upper conductive section and a wider lower conductive section.
- The upper conductive section of the contact plug is narrower than the lower conductive section in one direction.
Potential Applications
This technology could be applied in:
- Semiconductor manufacturing
- Integrated circuit design
Problems Solved
This technology helps in:
- Improving signal transmission efficiency
- Reducing space constraints in electronic devices
Benefits
The benefits of this technology include:
- Enhanced performance of electronic devices
- Increased reliability of signal transmission
Potential Commercial Applications
This technology could be used in:
- Consumer electronics
- Telecommunications industry
Possible Prior Art
One possible prior art for this technology could be:
- Existing methods of connecting conductive patterns at different wiring layers in electronic devices
Unanswered Questions
How does this technology compare to existing methods of connecting conductive patterns at different wiring layers?
This article does not provide a direct comparison with existing methods, so it is unclear how this technology improves upon current practices.
What specific electronic devices or applications would benefit most from this technology?
The article does not specify which electronic devices or applications would see the most significant improvements from implementing this technology.
Original Abstract Submitted
an apparatus that includes a first conductive pattern positioned at a first wiring layer and extending in a first direction, a second conductive pattern positioned at a second wiring layer located above the first wiring layer and extending in a second direction crossing the first direction, and a contact plug connecting the first conductive pattern with the second conductive pattern. the contact plug includes a lower conductive section contacting the first conductive pattern and an upper conductive section contacting the second conductive pattern. a maximum width of the upper conductive section in the first direction is smaller than a maximum width of the lower conductive section in the first direction.
