Micron technology, inc. (20240161812). Integrated Assemblies simplified abstract
Contents
- 1 Integrated Assemblies
Integrated Assemblies
Organization Name
Inventor(s)
Beau D. Barry of Boise ID (US)
Integrated Assemblies - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240161812 titled 'Integrated Assemblies
Simplified Explanation
The patent application describes an integrated assembly with a memory array over a base, sense amplifier circuitry, digit lines, and control circuitry for selective coupling.
- Memory array integrated over a base
- First sense amplifier circuitry with sense amplifiers directly under the memory array
- Vertically-extending digit lines associated with the memory array
- Second sense amplifier circuitry offset from the first sense amplifier circuitry
- Control circuitry for selectively coupling digit lines to voltage supply terminal or second sense amplifier circuitry
Potential Applications
This technology could be applied in:
- High-speed memory systems
- Data storage devices
- Embedded systems
Problems Solved
This technology addresses:
- Efficient data retrieval and storage
- Improved memory access speed
- Enhanced data processing capabilities
Benefits
The benefits of this technology include:
- Faster data access and retrieval
- Higher memory performance
- Increased efficiency in data processing
Potential Commercial Applications
This technology has potential in:
- Semiconductor industry
- Consumer electronics
- Information technology sector
Possible Prior Art
One possible prior art could be the use of separate sense amplifier circuitry in memory systems, but the specific configuration described in the patent application may be novel.
Unanswered Questions
How does this technology compare to existing memory array designs in terms of speed and efficiency?
This article does not provide a direct comparison with existing memory array designs to evaluate the speed and efficiency improvements offered by the described technology.
What are the potential manufacturing challenges associated with implementing this integrated assembly in mass production?
The article does not address the potential manufacturing challenges that may arise when scaling up the production of this integrated assembly.
Original Abstract Submitted
some embodiments include an integrated assembly having a memory array over a base. first sense-amplifier-circuitry is associated with the base and includes sense amplifiers directly under the memory array. vertically-extending digit lines are associated with the memory array and are coupled with the first sense-amplifier-circuitry. second sense-amplifier-circuitry is associated with the base and is offset from the first sense-amplifier-circuitry. control circuitry is configured to selectively couple the digit lines to either a voltage supply terminal or to the second sense-amplifier-circuitry.
