Micron technology, inc. (20240161264). DEFECT CHARACTERIZATION IN SEMICONDUCTOR DEVICES BASED ON IMAGE PROCESSING simplified abstract

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DEFECT CHARACTERIZATION IN SEMICONDUCTOR DEVICES BASED ON IMAGE PROCESSING

Organization Name

micron technology, inc.

Inventor(s)

Nagasubramaniyan Chandrasekaran of Eagle ID (US)

DEFECT CHARACTERIZATION IN SEMICONDUCTOR DEVICES BASED ON IMAGE PROCESSING - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240161264 titled 'DEFECT CHARACTERIZATION IN SEMICONDUCTOR DEVICES BASED ON IMAGE PROCESSING

Simplified Explanation

The patent application describes a system that can analyze images of electronic device substrates to identify regions of interest corresponding to electronic circuits.

  • The system includes a memory and a processing device.
  • The processing device receives an image of a substrate of an electronic device.
  • A feature extraction model processes the image to extract visual features.
  • A trainable feature classifier then identifies a region of interest corresponding to an electronic circuit associated with the device's performance.

Potential Applications

This technology could be used in quality control processes for electronic devices, helping to identify and analyze specific electronic circuits quickly and accurately.

Problems Solved

This system streamlines the process of identifying and analyzing electronic circuits on device substrates, reducing the potential for human error and increasing efficiency.

Benefits

The system can improve the accuracy and speed of analyzing electronic circuits, leading to better quality control and potentially faster production processes.

Potential Commercial Applications

"Enhancing Quality Control in Electronic Device Manufacturing with Image Analysis Technology"

Possible Prior Art

There may be prior art related to image analysis systems for electronic devices, but specific examples are not provided in this abstract.

Unanswered Questions

How does this technology compare to existing methods of analyzing electronic circuits on device substrates?

This article does not provide a direct comparison to existing methods, leaving the reader to wonder about the advantages and disadvantages of this new system.

What are the potential limitations or challenges of implementing this technology in real-world manufacturing environments?

The article does not address any potential obstacles or difficulties that may arise when integrating this system into electronic device manufacturing processes.


Original Abstract Submitted

a system includes a memory and a processing device, operatively coupled with the memory, to perform operations including: receiving an image of a substrate of an electronic device; extracting, by a feature extraction model processing the image, a plurality of visual features from the image; and identifying, by a trainable feature classifier processing the plurality of visual features, a region of interest corresponding to an electronic circuit associated with performance of the electronic circuit.