Micron Technology, Inc. patent applications published on September 5th, 2024
Summary of the patent applications from Micron Technology, Inc. on September 5th, 2024
1. 'Summary': Micron Technology, Inc. has recently filed patents for innovative memory cell structures, memory array designs, memory system reset technology, and advanced error correction technology for memory systems. These patents aim to enhance memory cell performance, improve data storage efficiency, optimize memory system communication, and ensure data integrity in memory systems.
2. 'Key Points of Patents':
- Memory Cell Structures: Support sidewall structures for memory cells in vertical structures, consisting of first electrode, second electrode, and self-selecting storage element with bulk and sidewall regions.
- Memory Array Design: Utilizes vertically-alternating tiers of insulative material and memory cells with transistors, capacitors, sense lines, capacitor-electrode structure, and access-line pillar.
- Memory System Reset Technology: Implements efficient reset techniques for protocol layers in memory systems to enhance system performance and reduce downtime for maintenance.
- Error Correction Technology: Utilizes ECC decoding to process data in memory components, constructing codewords, performing error correction, and enhancing data accuracy and system reliability.
3. 'Notable Applications':
- Memory cell structures can be used in memory storage devices, semiconductor industry, and data storage systems.
- Memory array design could find applications in electronic devices, data centers, and computing systems requiring high-density memory storage.
- Memory system reset technology can optimize memory system performance in data centers, servers, and networking equipment.
- Error correction technology is beneficial for data storage systems, communication systems, and information security applications.
Contents
- 1 Patent applications for Micron Technology, Inc. on September 5th, 2024
- 1.1 PERFORMANCE MANANGEMENT USING INTELLIGENT PRIORITIZATION OF MEMORY OPERATIONS (18593678)
- 1.2 MNAND FIELD TO PREDICT DEVICE PERFORMANCE (18590721)
- 1.3 PROGRAM VOLTAGE SELECTION DURING ALL LEVELS PROGRAMMING OF A MEMORY DEVICE (18593779)
- 1.4 DYNAMIC MEMORY MANAGEMENT OPERATION (18604118)
- 1.5 MEDIA SCAN METHOD TO REDUCE ACTIVE IDLE POWER OF MEMORY DEVICES (18423272)
- 1.6 CONFIGURABLE MEMORY DIE CAPACITANCE (18604203)
- 1.7 BAD BLOCK MAPPING BASED ON BAD BLOCK DISTRIBUTION IN A MEMORY SUB-SYSTEM (18587184)
- 1.8 Network-Ready Storage Products with Computational Storage Processors (18646650)
- 1.9 MEMORY WITH EFFICIENT STORAGE OF EVENT LOG DATA (18646668)
- 1.10 MOBILE STORAGE RANDOM READ PERFORMANCE ESTIMATION ENHANCEMENTS (18647677)
- 1.11 INTERLEAVED REED-SOLOMON (IRS) WITH COLLABORATIVE DECODING (18415627)
- 1.12 ACCESSING DATA USING ERROR CORRECTION OPERATION(S) TO REDUCE LATENCY AT A MEMORY SUB-SYSTEM (18655091)
- 1.13 MEMORY BANK PROTECTION (18660954)
- 1.14 APPARATUSES AND METHODS FOR READ COMMANDS WITH DIFFERENT LEVELS OF ECC CAPABILITY (18588402)
- 1.15 APPARATUSES AND METHODS FOR SELECTABLE EXPANSION OF ERROR CORRECTION CAPABILITY (18588373)
- 1.16 MAPPING DESCRIPTORS FOR READ OPERATIONS (18602994)
- 1.17 VOLTAGE-TRIGGERED PERFORMANCE THROTTLING (18441996)
- 1.18 PREDICTIVE CENTER ALLOCATION DATA STRUCTURE (18591851)
- 1.19 COHERENT MEMORY ACCESS (18129559)
- 1.20 NAMESPACE MAPPING STRUCTURAL ADJUSTMENT IN NON-VOLATILE MEMORY DEVICES (18659331)
- 1.21 CXL DRAM SWITCH FABRIC (18433191)
- 1.22 PREDICTIVE CENTER ALLOCATION DATA STRUCTURE (18591906)
- 1.23 DYNAMIC MACHINE READABLE CODE (18646934)
- 1.24 DATA INTEGRITY IMPROVEMENT PROGRAMMING TECHNIQUES (18404587)
- 1.25 MEMORY BLOCK CHARACTERISTIC DETERMINATION (18659845)
- 1.26 READ DISTURB MITIGATION BASED ON SIGNAL AND NOISE CHARACTERISTICS OF MEMORY CELLS COLLECTED FOR READ CALIBRATION (18657672)
- 1.27 TECHNIQUES FOR DETERMINING AN INTERFACE CONNECTION STATUS (18660002)
- 1.28 Methods of Forming Material Within Openings Extending into a Semiconductor Construction, and Semiconductor Constructions Having Fluorocarbon Material (18663364)
- 1.29 FLEXIBLE DESIGN AND PLACEMENT OF ALIGNMENT MARKS (18593504)
- 1.30 STACKED SEMICONDUCTOR DEVICE (18426271)
- 1.31 Memory Cells and Integrated Assemblies having Charge-Trapping-Material with Trap-Enhancing-Additive (18658367)
- 1.32 LIGHT EMITTING DIODES AND ASSOCIATED METHODS OF MANUFACTURING (18664203)
- 1.33 HETEROGENOUS INTERLEAVED REED-SOLOMON (HETIRS) WITH ERASURE DECODING (18415626)
- 1.34 RESET TECHNIQUES FOR PROTOCOL LAYERS OF A MEMORY SYSTEM (18590755)
- 1.35 Memory Arrays Comprising Vertically-Alternating Tiers Of Insulative Material And Memory Cells And Methods Of Forming A Memory Array Comprising Memory Cells Individually Comprising A Transistor And A Capacitor ([[Micron Technology, Inc. (18647122). Memory Arrays Comprising Vertically-Alternating Tiers Of Insulative Material And Memory Cells And Methods Of Forming A Memory Array Comprising Memory Cells Individually Comprising A Transistor And A Capacitor simplified abstract|18647122]])
- 1.36 SIDEWALL STRUCTURES FOR MEMORY CELLS IN VERTICAL STRUCTURES (18419190)
Patent applications for Micron Technology, Inc. on September 5th, 2024
PERFORMANCE MANANGEMENT USING INTELLIGENT PRIORITIZATION OF MEMORY OPERATIONS (18593678)
Main Inventor
Lei PAN
MNAND FIELD TO PREDICT DEVICE PERFORMANCE (18590721)
Main Inventor
Gianluca Coppola
PROGRAM VOLTAGE SELECTION DURING ALL LEVELS PROGRAMMING OF A MEMORY DEVICE (18593779)
Main Inventor
Sheyang Ning
DYNAMIC MEMORY MANAGEMENT OPERATION (18604118)
Main Inventor
Xing Wang
MEDIA SCAN METHOD TO REDUCE ACTIVE IDLE POWER OF MEMORY DEVICES (18423272)
Main Inventor
Dengfeng Ruan
CONFIGURABLE MEMORY DIE CAPACITANCE (18604203)
Main Inventor
Jingwei Cheng
BAD BLOCK MAPPING BASED ON BAD BLOCK DISTRIBUTION IN A MEMORY SUB-SYSTEM (18587184)
Main Inventor
Dahai Tian
Network-Ready Storage Products with Computational Storage Processors (18646650)
Main Inventor
Luca Bert
MEMORY WITH EFFICIENT STORAGE OF EVENT LOG DATA (18646668)
Main Inventor
Steven Gaskill
MOBILE STORAGE RANDOM READ PERFORMANCE ESTIMATION ENHANCEMENTS (18647677)
Main Inventor
David Aaron Palmer
INTERLEAVED REED-SOLOMON (IRS) WITH COLLABORATIVE DECODING (18415627)
Main Inventor
Joseph M. MCCRATE
ACCESSING DATA USING ERROR CORRECTION OPERATION(S) TO REDUCE LATENCY AT A MEMORY SUB-SYSTEM (18655091)
Main Inventor
Vamsi Pavan Rayaprolu
MEMORY BANK PROTECTION (18660954)
Main Inventor
Paolo Amato
APPARATUSES AND METHODS FOR READ COMMANDS WITH DIFFERENT LEVELS OF ECC CAPABILITY (18588402)
Main Inventor
Sujeet Ayyapureddi
APPARATUSES AND METHODS FOR SELECTABLE EXPANSION OF ERROR CORRECTION CAPABILITY (18588373)
Main Inventor
Sujeet Ayyapureddi
MAPPING DESCRIPTORS FOR READ OPERATIONS (18602994)
Main Inventor
Xing Hui Duan
VOLTAGE-TRIGGERED PERFORMANCE THROTTLING (18441996)
Main Inventor
Hui Wang
PREDICTIVE CENTER ALLOCATION DATA STRUCTURE (18591851)
Main Inventor
Leon Zlotnik
COHERENT MEMORY ACCESS (18129559)
Main Inventor
Timothy P. Finkbeiner
NAMESPACE MAPPING STRUCTURAL ADJUSTMENT IN NON-VOLATILE MEMORY DEVICES (18659331)
Main Inventor
Alex Frolikov
CXL DRAM SWITCH FABRIC (18433191)
Main Inventor
Satheesh Babu MUTHUPANDI
PREDICTIVE CENTER ALLOCATION DATA STRUCTURE (18591906)
Main Inventor
Leon Zlotnik
DYNAMIC MACHINE READABLE CODE (18646934)
Main Inventor
Yashvi SINGH
DATA INTEGRITY IMPROVEMENT PROGRAMMING TECHNIQUES (18404587)
Main Inventor
Christopher Joseph Bueb
MEMORY BLOCK CHARACTERISTIC DETERMINATION (18659845)
Main Inventor
Zhongyuan Lu
READ DISTURB MITIGATION BASED ON SIGNAL AND NOISE CHARACTERISTICS OF MEMORY CELLS COLLECTED FOR READ CALIBRATION (18657672)
Main Inventor
Patrick Robert Khayat
TECHNIQUES FOR DETERMINING AN INTERFACE CONNECTION STATUS (18660002)
Main Inventor
Melissa I. Uribe
Methods of Forming Material Within Openings Extending into a Semiconductor Construction, and Semiconductor Constructions Having Fluorocarbon Material (18663364)
Main Inventor
Gurtej S. Sandhu
FLEXIBLE DESIGN AND PLACEMENT OF ALIGNMENT MARKS (18593504)
Main Inventor
Shruthi Kumara Vadivel
STACKED SEMICONDUCTOR DEVICE (18426271)
Main Inventor
Bharat Bhushan
Memory Cells and Integrated Assemblies having Charge-Trapping-Material with Trap-Enhancing-Additive (18658367)
Main Inventor
Manzar Siddik
LIGHT EMITTING DIODES AND ASSOCIATED METHODS OF MANUFACTURING (18664203)
Main Inventor
Scott D. Schellhammer
HETEROGENOUS INTERLEAVED REED-SOLOMON (HETIRS) WITH ERASURE DECODING (18415626)
Main Inventor
Joseph M. MCCRATE
RESET TECHNIQUES FOR PROTOCOL LAYERS OF A MEMORY SYSTEM (18590755)
Main Inventor
Junjun Wang
Memory Arrays Comprising Vertically-Alternating Tiers Of Insulative Material And Memory Cells And Methods Of Forming A Memory Array Comprising Memory Cells Individually Comprising A Transistor And A Capacitor ([[Micron Technology, Inc. (18647122). Memory Arrays Comprising Vertically-Alternating Tiers Of Insulative Material And Memory Cells And Methods Of Forming A Memory Array Comprising Memory Cells Individually Comprising A Transistor And A Capacitor simplified abstract|18647122]])
Main Inventor
Durai Vishak Nirmal Ramaswamy
SIDEWALL STRUCTURES FOR MEMORY CELLS IN VERTICAL STRUCTURES (18419190)
Main Inventor
Lorenzo Fratin