Micron Technolgy, Inc. Patent Application Trends in 2024

Micron Technolgy, Inc. patent applications in 2024

Top 10 Technology Areas

• G06F3/0604 (Digital input from, or digital output to, record carriers {, e.g. RAID, emulated record carriers or networked record carriers})
  • Count: 4 patents
  • Example: 20240160349. VIRTUAL MANAGEMENT UNIT SCHEME FOR TWO-PASS PROGRAMMING IN A MEMORY SUB-SYSTEM simplified abstract (Micron Technolgy, Inc.)
• G06F3/0679 ({Non-volatile semiconductor memory device, e.g. flash memory, one time programmable memory [OTP]})
  • Count: 4 patents
  • Example: 20240160349. VIRTUAL MANAGEMENT UNIT SCHEME FOR TWO-PASS PROGRAMMING IN A MEMORY SUB-SYSTEM simplified abstract (Micron Technolgy, Inc.)
• G06F3/0655 ({Replication mechanisms})
  • Count: 3 patents
  • Example: 20240160349. VIRTUAL MANAGEMENT UNIT SCHEME FOR TWO-PASS PROGRAMMING IN A MEMORY SUB-SYSTEM simplified abstract (Micron Technolgy, Inc.)
• G11C7/1096 (Input/output [I/O] data interface arrangements, e.g. I/O data control circuits, I/O data buffers)
  • Count: 1 patents
  • Example: 20240203467. MEMORY SUB-SYSTEM MANAGEMENT BASED ON DYNAMIC CONTROL OF WORDLINE START VOLTAGE simplified abstract (Micron Technolgy, Inc.)
• G11C8/08 (Word line control circuits, e.g. drivers, boosters, pull-up circuits, pull-down circuits, precharging circuits, for word lines)
  • Count: 1 patents
  • Example: 20240203467. MEMORY SUB-SYSTEM MANAGEMENT BASED ON DYNAMIC CONTROL OF WORDLINE START VOLTAGE simplified abstract (Micron Technolgy, Inc.)
• G11C8/14 (Word line organisation; Word line lay-out)
  • Count: 1 patents
  • Example: 20240203467. MEMORY SUB-SYSTEM MANAGEMENT BASED ON DYNAMIC CONTROL OF WORDLINE START VOLTAGE simplified abstract (Micron Technolgy, Inc.)
• G11C16/10 (Programming or data input circuits)
  • Count: 1 patents
  • Example: 20240203467. MEMORY SUB-SYSTEM MANAGEMENT BASED ON DYNAMIC CONTROL OF WORDLINE START VOLTAGE simplified abstract (Micron Technolgy, Inc.)
• G06F3/0653 ({Monitoring storage devices or systems})
  • Count: 1 patents
  • Example: 20240134563. TRIM VALUES FOR MULTI-PLANE OPERATIONS simplified abstract (Micron Technolgy, Inc.)
• G06F12/02 (Addressing or allocation; Relocation (program address sequencing)
  • Count: 1 patents
  • Example: 20240176532. DATA REORDERING AT A MEMORY SUBSYSTEM simplified abstract (Micron Technolgy, Inc.)
• G06F3/0659 ({Command handling arrangements, e.g. command buffers, queues, command scheduling})
  • Count: 1 patents
  • Example: 20240241672. CHARGE LOSS MITIGATION THROUGHOUT MEMORY DEVICE LIFECYCLE BY PROACTIVE WINDOW SHIFT simplified abstract (Micron Technolgy, Inc.)

Emerging Technology Areas

• H01L2225/06527 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS)
  • Count: 1 patents
  • Example: 20240153910. FERROMAGNETIC CONTROL OF WAFER BONDING simplified abstract (Micron Technolgy, Inc.)
• H01L2225/06524 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS)
  • Count: 1 patents
  • Example: 20240153910. FERROMAGNETIC CONTROL OF WAFER BONDING simplified abstract (Micron Technolgy, Inc.)
• H01L2224/8322 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS)
  • Count: 1 patents
  • Example: 20240153910. FERROMAGNETIC CONTROL OF WAFER BONDING simplified abstract (Micron Technolgy, Inc.)
• H01L2224/743 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS)
  • Count: 1 patents
  • Example: 20240153910. FERROMAGNETIC CONTROL OF WAFER BONDING simplified abstract (Micron Technolgy, Inc.)
• H01L2224/291 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS)
  • Count: 1 patents
  • Example: 20240153910. FERROMAGNETIC CONTROL OF WAFER BONDING simplified abstract (Micron Technolgy, Inc.)
• H01L2224/29023 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS)
  • Count: 1 patents
  • Example: 20240153910. FERROMAGNETIC CONTROL OF WAFER BONDING simplified abstract (Micron Technolgy, Inc.)
• H10B80/00 (Assemblies of multiple devices comprising at least one memory device covered by this subclass)
  • Count: 1 patents
  • Example: 20240153910. FERROMAGNETIC CONTROL OF WAFER BONDING simplified abstract (Micron Technolgy, Inc.)
• H01L25/50 ({Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group)
  • Count: 1 patents
  • Example: 20240153910. FERROMAGNETIC CONTROL OF WAFER BONDING simplified abstract (Micron Technolgy, Inc.)
• H01L25/0657 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS)
  • Count: 1 patents
  • Example: 20240153910. FERROMAGNETIC CONTROL OF WAFER BONDING simplified abstract (Micron Technolgy, Inc.)
• H01L24/743 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS)
  • Count: 1 patents
  • Example: 20240153910. FERROMAGNETIC CONTROL OF WAFER BONDING simplified abstract (Micron Technolgy, Inc.)

Top Inventors

• Kishore Kumar Muchherla of Fremont CA (US) (2 patents)
• Johnny A. Lam of Firestone CO (US) (1 patent)
• Samyukta Mudugal of Erie CO (US) (1 patent)
• Sanjay Subbarao of Irvine CA (US) (1 patent)
• Byron D. Harris of Mead CO (US) (1 patent)
• Daniel A. Boals of Broomfield CO (US) (1 patent)
• Jiangang Wu of Milpitas CA (US) (1 patent)
• Lei Zhou (1 patent)
• Jung Sheng Hoei of Newark CA (US) (1 patent)
• Qisong Lin of El Dorado Hills CA (US) (1 patent)

Patent Categories

Geographical Distribution of Inventors

Geographical Distribution of US Inventors