Meta platforms technologies, llc (20240346221). CIRCUITS AND METHODS FOR REDUCING THE EFFECTS OF VARIATION IN INTER-DIE COMMUNICATION IN 3D-STACKED SYSTEMS simplified abstract

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CIRCUITS AND METHODS FOR REDUCING THE EFFECTS OF VARIATION IN INTER-DIE COMMUNICATION IN 3D-STACKED SYSTEMS

Organization Name

meta platforms technologies, llc

Inventor(s)

Matheus Trevisan Moreira of La Jolla CA (US)

Edith Dallard of San Mateo CA (US)

Huseyin Ekin Sumbul of San Francisco CA (US)

Fan Wu of Redwood City CA (US)

William Koven of San Jose CA (US)

CIRCUITS AND METHODS FOR REDUCING THE EFFECTS OF VARIATION IN INTER-DIE COMMUNICATION IN 3D-STACKED SYSTEMS - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240346221 titled 'CIRCUITS AND METHODS FOR REDUCING THE EFFECTS OF VARIATION IN INTER-DIE COMMUNICATION IN 3D-STACKED SYSTEMS

The patent application describes a device designed to mitigate the effects of variation in inter-die communication in 3D-stacked systems. This device includes modules that convert data between synchronous domains and a dual-rail quasi-delay-insensitive format.

  • The device converts data from a first synchronous domain to a dual-rail quasi-delay-insensitive format.
  • It then converts the data from the dual-rail quasi-delay-insensitive format to a second synchronous domain.

Potential Applications: - 3D-stacked systems - High-performance computing - Data centers

Problems Solved: - Reducing the effects of variation in inter-die communication - Improving data transfer efficiency in stacked systems

Benefits: - Enhanced communication reliability - Increased data transfer speed - Improved overall system performance

Commercial Applications: Title: "Innovative Interconnect Device for 3D-Stacked Systems" This technology could be utilized in various industries such as telecommunications, aerospace, and automotive for high-speed data processing and communication needs.

Questions about the technology: 1. How does the device address the challenges of inter-die communication in 3D-stacked systems? - The device tackles these challenges by converting data between synchronous domains and a dual-rail quasi-delay-insensitive format, ensuring efficient and reliable communication. 2. What are the potential implications of this technology for the future of stacked systems and high-performance computing? - This technology could pave the way for faster and more reliable data transfer in stacked systems, leading to significant advancements in high-performance computing capabilities.


Original Abstract Submitted

a device for reducing the effects of variation in inter-die communication in 3d-stacked systems may include a die-to-die interconnect that includes a first module configured to convert data from a first synchronous domain to a dual-rail quasi-delay-insensitive format and a second module configured to convert the data from the dual-rail quasi-delay-insensitive format to a second synchronous domain. various other devices, systems, and methods of manufacture are also disclosed.

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