MARS SEMICONDUCTOR CORP. (20240231745). SOC MODULE FOR AUDIO DATA TRANSMISSION AND AUDIO TRANSMISSION SYSTEM simplified abstract

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SOC MODULE FOR AUDIO DATA TRANSMISSION AND AUDIO TRANSMISSION SYSTEM

Organization Name

MARS SEMICONDUCTOR CORP.

Inventor(s)

LUEN-SHEN Yuan of HSINCHU CITY (TW)

YI-SHING Chang of HSINCHU CITY (TW)

SOC MODULE FOR AUDIO DATA TRANSMISSION AND AUDIO TRANSMISSION SYSTEM - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240231745 titled 'SOC MODULE FOR AUDIO DATA TRANSMISSION AND AUDIO TRANSMISSION SYSTEM

The abstract describes a system on chip (SoC) module with a first SoC for audio data transmission, featuring an audio data input/output interface unit, a processing unit, and a serial peripheral interface (SPI) unit. The audio data I/O interface unit is connected to multiple audio input devices to receive multiple pieces of first audio data. The processing unit stores the multiple pieces of audio data, and the SPI unit is connected to a second SoC via a SPI to transmit the audio data.

  • The system on chip (SoC) module includes a first SoC dedicated to audio data transmission.
  • The first SoC comprises an audio data input/output interface unit, a processing unit, and a serial peripheral interface (SPI) unit.
  • The audio data I/O interface unit is connected to multiple audio input devices to receive multiple pieces of first audio data.
  • The processing unit is responsible for storing the multiple pieces of audio data.
  • The SPI unit is connected to a second SoC via a SPI to transmit the multiple pieces of audio data.

Potential Applications: - This technology can be used in audio recording devices, such as microphones and audio interfaces. - It can also be applied in audio processing systems for real-time audio signal analysis and manipulation.

Problems Solved: - Efficient transmission and processing of multiple pieces of audio data from various input devices. - Seamless integration of audio data between different SoCs.

Benefits: - Improved audio data handling and transmission capabilities. - Enhanced performance and reliability in audio processing applications.

Commercial Applications: Title: Advanced Audio Data Transmission System for Audio Recording Devices This technology can be commercialized in the development of professional audio recording equipment, audio processing systems, and communication devices requiring high-quality audio transmission capabilities.

Prior Art: Readers can explore prior art related to audio data transmission systems, SoC modules, and SPI units in the field of audio technology and integrated circuits.

Frequently Updated Research: Researchers are continually exploring advancements in audio data transmission, SoC integration, and SPI communication protocols to enhance audio processing efficiency and performance.

Questions about the Technology: 1. How does this technology improve audio data transmission efficiency compared to traditional methods? 2. What are the potential challenges in implementing this system in complex audio processing applications?


Original Abstract Submitted

a system on chip (soc) module has a first soc for audio data transmission, and the first soc has an audio data input/output (i/o) interface unit, a processing unit and a serial peripheral interface (spi) unit. the audio data i/o interface unit is electrically connected to multiple audio input devices so as to receive multiple pieces of first audio data generated by the multiple audio input devices. the processing unit is used to store the multiple pieces of the first audio data. the spi unit is electrically connected to a second soc via a first spi, so as to transmit the multiple pieces of the first audio data to the second spi.