Lg electronics inc. (20250070447). ANTENNA MODULE IMPLEMENTED IN MULTI-LAYERED PACKAGE
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ANTENNA MODULE IMPLEMENTED IN MULTI-LAYERED PACKAGE
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Inventor(s)
ANTENNA MODULE IMPLEMENTED IN MULTI-LAYERED PACKAGE
This abstract first appeared for US patent application 20250070447 titled 'ANTENNA MODULE IMPLEMENTED IN MULTI-LAYERED PACKAGE
Original Abstract Submitted
an antenna module includes: a printed circuit board (pcb) having a plurality of layers; an array antenna portion having a plurality of antenna elements disposed on the pcb; and a plurality of signal connection lines configured to electrically connect a radio frequency integrated circuit (rfic) chip to the array antenna portion. each of the plurality of antenna elements may have a structure with two patch antennas, and first and second groups of second patch antennas disposed inside the pcb may be located in first and second regions with respect to a center line of an inner layer where the second patch antennas are disposed.
