Kioxia corporation (20240315026). SEMICONDUCTOR STORAGE DEVICE simplified abstract
Contents
SEMICONDUCTOR STORAGE DEVICE
Organization Name
Inventor(s)
SEMICONDUCTOR STORAGE DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240315026 titled 'SEMICONDUCTOR STORAGE DEVICE
Simplified Explanation: The patent application describes a semiconductor storage device with a unique structure involving multiple sub-pillars.
- The device includes first and second sub-pillars, with the first sub-pillar made of a single substance of a first insulating layer in the lower layer and the second sub-pillar made of a semiconductor layer in the upper layer.
- The second sub-pillar also features insulating layers covering its sidewalls, including a third insulating layer and a fourth insulating layer with a different material.
- This innovative design allows for efficient stacking and organization of components within the semiconductor storage device.
Key Features and Innovation:
- Unique sub-pillar structure with insulating layers.
- Efficient stacking of components.
- Improved organization within the semiconductor storage device.
Potential Applications:
- Memory storage devices.
- Data centers.
- High-performance computing systems.
Problems Solved:
- Enhanced efficiency in semiconductor storage devices.
- Improved data processing capabilities.
- Better organization of components.
Benefits:
- Increased data storage capacity.
- Faster data processing speeds.
- Enhanced overall performance of semiconductor storage devices.
Commercial Applications: Potential commercial applications include:
- Manufacturing of memory storage devices.
- Integration into data center infrastructure.
- Implementation in high-performance computing systems.
Prior Art: Readers interested in prior art related to this technology can explore research papers, patents, and industry publications on semiconductor storage devices and advanced stacking techniques.
Frequently Updated Research: Stay updated on the latest advancements in semiconductor storage devices, insulating layer technologies, and stacking methods to enhance the efficiency and performance of data storage systems.
Questions about semiconductor storage devices: 1. How does the unique sub-pillar structure improve the efficiency of semiconductor storage devices? 2. What are the potential long-term implications of this innovative design on the semiconductor industry?
Original Abstract Submitted
according to one embodiment, in a semiconductor storage device, a plurality of second pillars each includes a first sub-pillar that is a single substance of a first insulating layer extending in the stacking direction in a lower layer side of a stacked body and a second sub-pillar arranged at a height position in an upper layer side of the stacked body to correspond to the first sub-pillar. the second sub-pillar includes a semiconductor layer extending in the stacking direction at the height position in the upper layer side of the stacked body, a second insulating layer covering a sidewall of the semiconductor layer, a third insulating layer covering a sidewall of the second insulating layer, and a fourth insulating layer that includes a different material from the second and third insulating layers and is interposed between the second and third insulating layers.
