Kioxia corporation (20240315016). SEMICONDUCTOR DEVICE AND METHODS FOR MANUFACTURING THE SAME simplified abstract
Contents
SEMICONDUCTOR DEVICE AND METHODS FOR MANUFACTURING THE SAME
Organization Name
Inventor(s)
Seungkeun Baek of Yokkaichi Mie (JP)
Teruhisa Sonohara of Yokkaichi Mie (JP)
SEMICONDUCTOR DEVICE AND METHODS FOR MANUFACTURING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240315016 titled 'SEMICONDUCTOR DEVICE AND METHODS FOR MANUFACTURING THE SAME
Simplified Explanation: The semiconductor device described in the patent application consists of a stacked film with multiple electrodes and insulating films, plugs that extend through the stacked film, and a columnar portion with a charge storage layer and a semiconductor layer.
- The stacked film includes electrodes and insulating films stacked alternately in a specific direction.
- Plugs extend through the stacked film and are electrically connected to the electrodes.
- The columnar portion includes a charge storage layer and a semiconductor layer.
- The electrodes and plugs are made of metal layers, with the plugs being integrally formed with the electrodes.
Key Features and Innovation:
- Stacked film design with alternating electrodes and insulating films.
- Plugs for electrical connection extending through the stacked film.
- Columnar portion with charge storage and semiconductor layers.
- Integration of metal layers in electrodes and plugs.
Potential Applications: This technology could be used in semiconductor devices for various electronic applications, such as memory storage or signal processing.
Problems Solved: The technology addresses the need for efficient electrical connections and charge storage in semiconductor devices.
Benefits:
- Improved performance and reliability of semiconductor devices.
- Enhanced electrical connectivity and charge storage capabilities.
- Potential for smaller and more efficient electronic devices.
Commercial Applications: Potential commercial applications include memory chips, processors, and other electronic components where efficient charge storage and electrical connectivity are essential for performance.
Prior Art: Readers can explore prior research on semiconductor device design, charge storage technologies, and metal integration in electronic components to understand the background of this innovation.
Frequently Updated Research: Researchers may find updated studies on semiconductor materials, device design, and charge storage technologies relevant to this innovation.
Questions about Semiconductor Device Technology: 1. What are the key components of a semiconductor device? 2. How does the integration of metal layers in electrodes and plugs impact device performance?
Original Abstract Submitted
a semiconductor device includes a stacked film, a plurality of plugs, and a columnar portion. the stacked film includes a plurality of electrodes, which includes a first electrode, and a plurality of first insulating films alternately stacked in a first direction. the plurality of plugs extends through the stacked film in the first direction. the plurality of plugs includes a first plug electrically connected to the first electrode. the columnar portion extends through the stacked film in the first direction. the columnar portion includes a charge storage layer and a semiconductor layer. the first electrode includes a metal layer and the first plug includes a metal layer that is integrally formed with the metal layer of the first electrode and formed of a same material as a material of the metal layer of the first electrode.
