Kioxia corporation (20240312958). SEMICONDUCTOR DEVICE simplified abstract
Contents
SEMICONDUCTOR DEVICE
Organization Name
Inventor(s)
Toshimitsu Arai of Chigasaki Kanagawa (JP)
SEMICONDUCTOR DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240312958 titled 'SEMICONDUCTOR DEVICE
The semiconductor device described in the abstract consists of two semiconductor chips attached to each other using adhesives.
- The first semiconductor chip has a first adhesive attached to its rear surface.
- The second semiconductor chip has a second adhesive attached to its rear surface.
- The second semiconductor chip is attached to the front surface of the first semiconductor chip using the second adhesive.
- The second semiconductor chip has an overhang region that does not overlap the first semiconductor chip.
- The first adhesive includes a base portion and an extension portion that extends beyond the edge of the first semiconductor chip.
- At least a part of the extension portion of the first adhesive overlaps the overhang region of the second semiconductor chip.
Potential Applications: - This technology could be used in the manufacturing of advanced semiconductor devices. - It may find applications in the development of compact electronic devices.
Problems Solved: - This technology allows for the secure attachment of multiple semiconductor chips. - It enables the creation of more complex and compact electronic devices.
Benefits: - Improved reliability in semiconductor device assembly. - Enhanced performance in electronic devices. - Potential for miniaturization of electronic components.
Commercial Applications: Title: Advanced Semiconductor Device Assembly Technology This technology could be utilized in the production of smartphones, tablets, and other consumer electronics. It may also have applications in the automotive and aerospace industries for the development of advanced electronic systems.
Questions about the technology: 1. How does the overhang region of the second semiconductor chip affect the overall structure of the device? 2. What are the advantages of using adhesives for attaching semiconductor chips in this manner?
Original Abstract Submitted
according to one embodiment, a semiconductor device comprises: a first semiconductor chip on which a first adhesive is attached to a rear surface thereof; and a second semiconductor chip on which a second adhesive is attached to a rear surface thereof, wherein the second semiconductor chip is attached to a front surface of the first semiconductor chip via the second adhesive, the second semiconductor chip has an overhang region that does not overlap the first semiconductor chip when viewed in a first direction, and the first adhesive includes a base portion and also includes an extension portion that extends in a second direction from the base portion of the first adhesive to beyond an edge of the first semiconductor chip, at least a part of the extension portion of the first adhesive overlapping the overhang region of the second semiconductor chip when viewed in the first direction.
