Kioxia corporation (20240312809). SEMICONDUCTOR MANUFACTURING APPARATUS simplified abstract
Contents
SEMICONDUCTOR MANUFACTURING APPARATUS
Organization Name
Inventor(s)
Takashi Ohashi of Yokkaichi Mie (JP)
SEMICONDUCTOR MANUFACTURING APPARATUS - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240312809 titled 'SEMICONDUCTOR MANUFACTURING APPARATUS
The semiconductor manufacturing apparatus described in the abstract includes a front end module with a load port and processing units arranged around it to process semiconductor substrates.
- The front end module has a load port connected to a conveyance container on its upper surface.
- Multiple processing units are positioned around the front end module in a plan view.
- Each processing unit is connected to the front end module from at least two directions in the plan view.
- Semiconductor substrates are conveyed between the conveyance container and the processing units through the front end module.
Potential Applications: - Semiconductor manufacturing industry - Electronics manufacturing
Problems Solved: - Efficient processing of semiconductor substrates - Streamlined workflow in semiconductor manufacturing
Benefits: - Increased productivity in semiconductor manufacturing - Enhanced efficiency in processing semiconductor substrates
Commercial Applications: Title: Semiconductor Manufacturing Automation System This technology can be used in semiconductor fabrication facilities to automate the processing of semiconductor substrates, leading to increased production output and cost savings. The market implications include improved competitiveness for semiconductor manufacturers and enhanced product quality.
Questions about Semiconductor Manufacturing Automation System: 1. How does this technology improve the efficiency of semiconductor manufacturing processes?
- This technology streamlines the workflow by automating the conveyance of semiconductor substrates between the load port and processing units, reducing manual labor and increasing productivity.
2. What are the potential cost savings associated with implementing this semiconductor manufacturing apparatus?
- By automating the processing of semiconductor substrates, this technology can lead to reduced labor costs and increased production output, resulting in overall cost savings for semiconductor manufacturers.
Original Abstract Submitted
a semiconductor manufacturing apparatus includes a front end module with a load port to which a conveyance container is connected on an upper surface; and a plurality of processing units configured to process a semiconductor substrate, disposed around the front end module in a plan view from a normal direction of the upper surface of the front end module, and each connected to the front end module from at least two directions in the plan view. the semiconductor substrate is conveyed between the conveyance container and the processing units via the front end module.
