Kioxia corporation (20240312761). DRAWING DEVICE AND DRAWING METHOD simplified abstract
Contents
DRAWING DEVICE AND DRAWING METHOD
Organization Name
Inventor(s)
Yoshinori Kagawa of Shinagawa Tokyo (JP)
DRAWING DEVICE AND DRAWING METHOD - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240312761 titled 'DRAWING DEVICE AND DRAWING METHOD
The patent application describes a drawing device that utilizes a beam of charged particles to draw patterns on a target drawing region.
- The device includes optical elements that control the beam to irradiate divided regions of the target drawing region based on the pattern density.
- A control computer divides the target drawing region and selectively executes irradiations on the divided regions to ensure the beam reaches the required irradiation amount on each region.
- The technology allows for precise and efficient drawing of patterns on a target surface using charged particles.
Potential Applications: - Semiconductor manufacturing - Microelectronics fabrication - Nanotechnology research
Problems Solved: - Achieving precise and controlled drawing of patterns on a target surface - Improving efficiency in the manufacturing process
Benefits: - Enhanced precision in pattern drawing - Increased efficiency in manufacturing processes - Potential for advancements in nanotechnology research
Commercial Applications: Title: Advanced Charged Particle Drawing Device for Semiconductor Manufacturing This technology can be used in industries such as semiconductor manufacturing, microelectronics fabrication, and nanotechnology research. It offers a more precise and efficient method for drawing patterns on target surfaces, leading to improved productivity and quality in manufacturing processes.
Questions about the technology: 1. How does the device control the beam of charged particles to ensure precise drawing on the target surface? - The device uses a group of optical elements and a control computer to divide the target drawing region and selectively execute irradiations on divided regions based on the pattern density.
2. What are the potential applications of this technology beyond semiconductor manufacturing? - This technology can also be applied in microelectronics fabrication and nanotechnology research for precise pattern drawing on target surfaces.
Original Abstract Submitted
a drawing device includes a device configured to generate a beam of charged particles, a group of optical elements disposed in a path of the beam, the group of optical elements being controlled so that the beam irradiates each of a plurality of divided regions of a target drawing region on which a pattern is to be drawn with the beam, and a control computer configured to divide the target drawing region into the divided regions based on a density of the pattern, and to execute first to n-th irradiations (n is an integer of 2 or more) selectively on the divided regions so that a total irradiation amount of the beam on each of the divided regions reaches a required irradiation amount therefor.
