Kabushiki kaisha toshiba (20240321977). SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING simplified abstract

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING

Organization Name

kabushiki kaisha toshiba

Inventor(s)

Akira Yoshioka of Yokohama Kanagawa (JP)

Hitoshi Kobayashi of Yamato Kanagawa (JP)

Hideki Sekiguchi of Yokohama Kanagawa (JP)

Hung Hung of Kawasaki Kanagawa (JP)

Yasuhiro Isobe of Narashino Chiba (JP)

Toru Sugiyama of Musashino Tokyo (JP)

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240321977 titled 'SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING

The semiconductor device described in the abstract consists of multiple layers and electrodes, as well as conductive and insulating parts. The first semiconductor layer is the base, with the second semiconductor layer on top. The first electrode, made up of an electrode part and an extension part, sits on the second semiconductor layer. A conductive part connects the first and second electrodes, while an insulating part separates the conductive part from the electrode extension part.

• The semiconductor device includes a first semiconductor layer, a second semiconductor layer, and multiple electrodes and parts for connectivity and insulation.
• The first electrode is composed of an electrode part and an extension part, with the electrode part in direct contact with the second semiconductor layer.
• A conductive part bridges the first and second electrodes, while an insulating part ensures separation between the conductive part and the electrode extension part.
• The design of this semiconductor device allows for efficient electrical connections and insulation within the device structure.
• The arrangement of layers and parts in the device contributes to its overall functionality and performance.

Potential Applications: This technology could be applied in various electronic devices such as sensors, transistors, and integrated circuits.

Problems Solved: This technology addresses the need for reliable electrical connections and insulation in semiconductor devices.

Benefits: The semiconductor device design offers improved performance and reliability in electronic applications.

Commercial Applications: This technology could be utilized in the manufacturing of advanced electronic devices for various industries, including telecommunications, consumer electronics, and automotive.

Questions about the technology: 1. How does the design of the semiconductor device contribute to its overall efficiency and performance? 2. What specific advantages does this technology offer compared to traditional semiconductor device designs?

Original Abstract Submitted

a semiconductor device includes a first semiconductor layer, a second semiconductor layer, a first electrode, a second electrode, a conductive part, an insulating part, and a third electrode. the second semiconductor layer is located on the first semiconductor layer. the first electrode is located on the second semiconductor layer. the first electrode includes an electrode part and an electrode extension part. the electrode part contacts the second semiconductor layer. the electrode extension part extends from an upper end portion of the electrode part. the conductive part is positioned between the first electrode and the second electrode. the conductive part contacts an upper surface of the second semiconductor layer and contacting the first electrode. the insulating part is located on the conductive part and is positioned between the conductive part and the electrode extension part.