Kabushiki kaisha toshiba (20240321974). SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MODULE simplified abstract

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SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MODULE

Organization Name

kabushiki kaisha toshiba

Inventor(s)

Hideki Sekiguchi of Yokohama Kanagawa (JP)

Akira Yoshioka of Yokohama Kanagawa (JP)

Toru Sugiyama of Musashino Tokyo (JP)

Yasuhiro Isobe of Narashino Chiba (JP)

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MODULE - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240321974 titled 'SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MODULE

The semiconductor device described in the abstract consists of multiple layers, electrodes, an insulating region, and a conductive layer. The device is designed with specific arrangements and connections to enable its functionality.

  • The first semiconductor layer is the base on which the second semiconductor layer is placed.
  • The first electrode is positioned on the second semiconductor layer.
  • The second electrode is located on the second semiconductor layer and aligned with the first electrode in a specific direction.
  • The third electrode is situated between the first and second electrodes.
  • The insulating region is on the second semiconductor layer, between the first electrode and the second electrode, and adjacent to the first electrode.
  • The insulating region comprises two insulating portions, with the second insulating portion positioned above the first insulating portion.
  • The conductive layer is between the two insulating portions and is electrically connected to the first electrode.

Potential Applications: - This semiconductor device can be used in various electronic applications that require precise control of electrical currents. - It can be utilized in power electronics, sensors, and communication devices.

Problems Solved: - The device addresses the need for efficient electrical connections and insulation in semiconductor components. - It provides a solution for optimizing the performance of electronic devices.

Benefits: - Improved functionality and reliability of electronic systems. - Enhanced control and efficiency of electrical currents. - Potential for miniaturization and integration in compact electronic devices.

Commercial Applications: Title: Advanced Semiconductor Device for Enhanced Electronic Performance This technology can be applied in the development of high-performance electronic devices for industries such as telecommunications, automotive, and consumer electronics. The improved efficiency and reliability offered by this semiconductor device can lead to cost savings and enhanced product performance in various commercial applications.

Questions about the technology: 1. How does the arrangement of electrodes and insulating regions contribute to the overall performance of the semiconductor device? 2. What specific advantages does the conductive layer provide in terms of electrical connectivity and functionality?


Original Abstract Submitted

a semiconductor device includes first and second semiconductor layers, first to third electrodes, an insulating region and a conductive layer. the second semiconductor layer is located on the first semiconductor layer. the first electrode is located on the second semiconductor layer. the second electrode is located on the second semiconductor layer and arranged with the first electrode in a second direction. the third electrode is positioned between the first electrode and the second electrode. the insulating region is located on the second semiconductor layer. the insulating region is between the first electrode and the second electrode and next to the first electrode. the insulating region includes first and second insulating portions. the second insulating portion is positioned above the first insulating portion. the conductive layer is located between the first insulating portion and the second insulating portion. the conductive layer is electrically connected with the first electrode.