Kabushiki kaisha toshiba (20240321638). METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE simplified abstract
Contents
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
Organization Name
Inventor(s)
Takeyuki Suzuki of Kaga Ishikawa (JP)
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240321638 titled 'METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
The method of manufacturing a semiconductor device involves separating a second part from a first part on a semiconductor substrate by polishing and cutting a first conductive film between them.
- Semiconductor device manufacturing method involving substrate and sheet
- Substrate with semiconductor substrate, first part, second part, and first conductive film
- Sheet attached to first conductive film on second part
- Separation of second part from first part by pressing and polishing
- Cutting of first conductive film between separated parts by pressing
- Keywords: semiconductor device, substrate, conductive film, polishing, cutting
Potential Applications: - Semiconductor manufacturing industry - Electronics manufacturing - Semiconductor research and development
Problems Solved: - Efficient separation and cutting of semiconductor parts - Precision in manufacturing semiconductor devices
Benefits: - Improved manufacturing process - Enhanced quality control - Cost-effective production
Commercial Applications: - Semiconductor device production - Electronics industry - Research institutions
Prior Art: Prior research on semiconductor device manufacturing methods and techniques can be found in academic journals, patent databases, and industry publications.
Frequently Updated Research: Ongoing research in semiconductor manufacturing focuses on improving efficiency, precision, and cost-effectiveness in the production process.
Questions about Semiconductor Device Manufacturing: 1. What are the key steps involved in the separation and cutting process of semiconductor parts? 2. How does the use of a polishing tape contribute to the precision of the manufacturing process?
Original Abstract Submitted
a method of manufacturing a semiconductor device according to an embodiment includes: the method of manufacturing a semiconductor device from a substrate and a sheet, the substrate including a semiconductor substrate including a first part including a first surface and a second surface provided on the opposite side of the first surface, and an annular second part surrounding the second surface and protruding from the second surface in a direction perpendicular to the second surface, and a first conductive film provided in contact with a top surface and an inner side surface of the second part, and the second surface, the sheet being attached to the first conductive film provided in contact with the top surface and the inner side surface of the second part, and the second surface; the method comprising: separating the second part from the first part by pressing a polishing tape against the first surface provided on the opposite side of the second part and polishing the semiconductor substrate; and cutting the first conductive film between the first part and the separated second part by pressing the polishing tape against the first conductive film between the first part and the separated second part.
