Kabushiki kaisha toshiba (20240312960). SEMICONDUCTOR DEVICE simplified abstract
Contents
SEMICONDUCTOR DEVICE
Organization Name
Inventor(s)
Shun Takeda of Yokohama Kanagawa (JP)
Hiroshi Kono of Himeji Hyogo (JP)
SEMICONDUCTOR DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240312960 titled 'SEMICONDUCTOR DEVICE
The semiconductor device described in the abstract consists of multiple chips arranged in a specific order.
- The chips include a first chip, a second chip next to the first chip in one direction, a third chip closer to the other end in that direction than the second chip, and a fourth chip adjacent to the third chip on the other end side in that direction.
- The distances between the chips are such that the first and second chips, as well as the third and fourth chips, are closer together than two other adjacent chips in the arrangement.
- This configuration optimizes the layout and connectivity of the chips within the semiconductor device.
Potential Applications: - This technology can be applied in the manufacturing of advanced electronic devices such as smartphones, tablets, and computers. - It can also be used in the development of high-performance computing systems and data centers.
Problems Solved: - Efficient arrangement of chips to optimize performance and connectivity. - Space-saving design for compact electronic devices.
Benefits: - Improved overall performance of semiconductor devices. - Enhanced connectivity and data transfer speeds. - Space-efficient design for compact electronic devices.
Commercial Applications: - This technology can be utilized by semiconductor manufacturers to produce high-performance electronic devices for consumer and industrial use. - It can also benefit companies involved in the development of advanced computing systems and data processing technologies.
Questions about the technology: 1. How does the specific arrangement of chips in the semiconductor device contribute to its overall performance? 2. What are the potential challenges in implementing this technology in mass production?
Original Abstract Submitted
according to one embodiment, a semiconductor device includes a plurality of chips, in which the plurality of chips include a first chip, a second chip adjacent to the first chip on the other end side in the first direction, a third chip closer to the other end side in the first direction than the second chip, and a fourth chip adjacent to the third chip on the other end side in the first direction, which are arranged from one end side to the other end side in a first direction, and a first distance between the first chip and the second chip, and a second distance between the third chip and the fourth chip are less than a third distance between, among the plurality of chips, two chips adjacent to each other in a region closer to the other end side in the first direction than the first chip and closer to the one end side in the first direction than the fourth chip.
